Climate sensor

Description

FIG. 1 is an upper front perspective view of the novel climate sensor.

FIG. 2 is a lower front perspective view of the sensor of FIG. 1.

FIG. 3 is an upper rear perspective view of the novel sensor of FIG. 1.

FIG. 4 is a lower rear perspective view of the novel sensor of FIG. 1.

FIG. 5 is a front side view of the sensor of FIG. 1.

FIG. 6 is a rear side view of the sensor of FIG. 1.

FIG. 7 is a right side view of the sensor of FIG. 1.

FIG. 8 is a left side view of the sensor of FIG. 1.

FIG. 9 is a top view of the sensor of FIG. 1; and,

FIG. 10 is a bottom view of the sensor of FIG. 1.

Claims

CLAIM The ornamental design for a climate sensor, as shown and described.

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Inventors:	Trishaun; Marquette (Orlando, FL)
Applicant:	Name City State Country Type HipScience, LLC Orlando FL US
Assignee:	HipScience, LLC (Orlando, FL)
Appl. No.:	D/564,956
Filed:	May 17, 2016

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Current U.S. Class:	D10/53; D10/52
Current International Class:	1004
Field of Search:	;D10/52,53

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References Cited [Referenced By]

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U.S. Patent Documents

D377321	January 1997	Tomizawa
D747984	January 2016	Zhao
D756248	May 2016	Rosenberg
D764320	August 2016	Li
2012/0130548	May 2012	Fadell

Other References

IoT made easy, Simplelink Sensor Tag--TI.com, retrieved May 13, 2016, http://www.ti.com/ww/en/wirelessconnectivity/sensortag2015/tearDown.htm1,- 3 pages. cited by applicant . Environmental and Biometric Sensor Puck with Bluetooth Low Energy and iOS/Android App, retrieved May 13, 2016, https://www.silabs.com/products/sensors/Pages/environmental-biometric-sen- sor-puck.aspx, 4 pages. cited by applicant.

Primary Examiner: Davis; Antoine D
Attorney, Agent or Firm: Steinberger; Brian S. Law Offices of Brian S. Steinberger, P.A.