Electronic device

Description

FIG. 1 is a first perspective view of a first embodiment of an electronic device, taken from above;

FIG. 2 is a second perspective view of the first embodiment of the electronic device, taken from the below;

FIG. 3 is a front view of the first embodiment of the electronic device as shown in FIG. 1;

FIG. 4 is a back view of the first embodiment of the electronic device as shown in FIG. 1;

FIG. 5 is a right-side view of the first embodiment of the electronic device as shown in FIG. 1;

FIG. 6 is a left-side view of the first embodiment of the electronic device as shown in FIG. 1;

FIG. 7 is a top view of the first embodiment of the electronic device as shown in FIG. 1;

FIG. 8 is a bottom view of the first embodiment of the electronic device as shown in FIG. 1;

FIG. 9 is a first perspective view of a second embodiment of an electronic device, taken from above;

FIG. 10 is a second perspective view of the second embodiment of the electronic device, taken from the below;

FIG. 11 is a front view of the second embodiment of the electronic device as shown in FIG. 9;

FIG. 12 is a back view of the second embodiment of the electronic device as shown in FIG. 9;

FIG. 13 is a right-side view of the second embodiment of the electronic device as shown in FIG. 9;

FIG. 14 is a left-side view of the second embodiment of the electronic device as shown in FIG. 9;

FIG. 15 is a top view of the second embodiment of the electronic device as shown in FIG. 9; and,

FIG. 16 is a bottom view of the second embodiment of the electronic device as shown in FIG. 9.

The broken lines represent features of the electronic device which form no part of the claimed design.

Claims

CLAIM The ornamental design for an electronic device, as shown and described.

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Inventors:	Langhammer; Heinz-Dominik (San Francisco, CA), McWilliam; Giles David Matthew (San Francisco, CA), Walliser; Marc Rene (San Francisco, CA)
Applicant:	Name City State Country Type Amazon Technologies, Inc. Seattle WA US
Assignee:	Amazon Technologies, Inc. (Seattle, WA)
Appl. No.:	D/568,676
Filed:	June 20, 2016

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Current U.S. Class:	D14/496; D14/203.3; D14/203.6
Current International Class:	1403
Field of Search:	;D14/496,401,435,474,483,217,137,138,160,168,356,203.1-203.8,507 ;345/156,169,173-179,905 ;715/727-729,864 ;710/1,5,8 ;713/1,600 ;455/1.1,1.7,73,344-347,93,95,3.01-3.06,550.1,573.1 ;370/342-344 ;369/1,2,6-12 ;463/43-47 ;273/148B

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References Cited [Referenced By]

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U.S. Patent Documents

D527017	August 2006	Kim
7277272	October 2007	Hsiung
D554614	November 2007	Lin
D609718	February 2010	Chang
8090418	January 2012	Thiel
D753625	April 2016	Young
D769327	October 2016	Morillo Garcia
D771142	November 2016	Langhammer
D775233	December 2016	Beck
D778956	February 2017	Langhammer

Other References

The Indian Office Action mailed Feb. 7, 2017 for Indian patent application No. 289432, a counterpart foreign application of design U.S. Appl. No. 29/568,676, 2 pages. cited by applicant . The Indian Office Action mailed Jan. 9, 2017 for Indian patent application No. 289433, a counterpart foreign application of design U.S. Appl. No. 29/568,676, 3 pages. cited by applicant.

Primary Examiner: Deshmukh; Prabhakar G
Attorney, Agent or Firm: Lee & Hayes, PLLC