Blister package
Pan , et al. June 27, 2
U.S. patent number D790,334 [Application Number D/554,381] was granted by the patent office on 2017-06-27 for blister package. This patent grant is currently assigned to RECKITT BENCKISER (BRANDS) LIMITED. The grantee listed for this patent is Reckitt Benckiser (Brands) Limited. Invention is credited to Kevin Pan, Teun Franciscus van Wetten, Piotr Zaborniak.
| United States Patent | D790,334 |
| Pan , et al. | June 27, 2017 |
Blister package
Claims
CLAIM The ornamental design for a blister package, as shown and described.
| Inventors: | Pan; Kevin (Dongguan, CN), Zaborniak; Piotr (Hull, GB), van Wetten; Teun Franciscus (Eindhoven, NL) | ||||||||||
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| Applicant: |
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| Assignee: | RECKITT BENCKISER (BRANDS)
LIMITED (Slough, GB) |
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| Appl. No.: | D/554,381 | ||||||||||
| Filed: | February 11, 2016 |
Foreign Application Priority Data
| Aug 17, 2015 [EM] | 002755736-0003 | |||
| Current U.S. Class: | D9/423 |
| Current International Class: | 0903 |
| Field of Search: | ;D9/423,414,449,420,429,500,504,428 ;D3/289,203.2,201,302 ;D14/204 ;D24/104 ;D6/407 ;D7/629,392.1,538 ;206/308.1,205 ;132/301 |
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Attorney, Agent or Firm: Troutman Sanders LLP Schneider; Ryan Davis; Chris
Description
FIG. 1 is a perspective view of a blister package of the present invention;
FIG. 2 is a front view of the blister package of FIG. 1;
FIG. 3 is a back view of the blister package of FIG. 1;
FIG. 4 is a side view of the blister package of FIG. 1;
FIG. 5 is the other side view of the blister package of FIG. 1;
FIG. 6 is a top view of the blister package of FIG. 1; and,
FIG. 7 is a bottom view of the blister package of FIG. 1.
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