U.S. patent number D788,371 [Application Number D/506,540] was granted by the patent office on 2017-05-30 for compact.
This patent grant is currently assigned to AMOREPACIFIC CORPORATION. The grantee listed for this patent is Amorepacific Corporation. Invention is credited to Hye Jin Lee.
United States Patent |
D788,371 |
Lee |
May 30, 2017 |
Compact
Claims
CLAIM The ornamental design for a compact, as shown and described.
Inventors: |
Lee; Hye Jin (Seoul,
KR) |
Applicant: |
Name |
City |
State |
Country |
Type |
Amorepacific Corporation |
Seoul |
N/A |
KR |
|
|
Assignee: |
AMOREPACIFIC CORPORATION
(Seoul, KR)
|
Appl.
No.: |
D/506,540 |
Filed: |
October 16, 2014 |
Foreign Application Priority Data
|
|
|
|
|
Apr 16, 2014 [KR] |
|
|
30-2014-0019283 |
|
Current U.S.
Class: |
D28/82 |
Current International
Class: |
2803 |
Field of
Search: |
;D28/76-84
;D9/772,428 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Rivard; Jennifer
Attorney, Agent or Firm: Ohlandt, Greeley, Ruggiero &
Perle, L.L.P.
Description
FIG. 1 is a perspective view of the compact of the present
invention;
FIG. 2 is a front elevation view of the compact shown in FIG.
1;
FIG. 3 is a rear elevation view of the compact shown in FIG. 1;
FIG. 4 is a left side elevation view of the compact shown in FIG.
1;
FIG. 5 is a right side elevation view of the compact shown in FIG.
1;
FIG. 6 is a top plan view of the compact shown in FIG. 1; and,
FIG. 7 is a bottom plan view of the compact shown in FIG. 1.
* * * * *