Backpack

Kim , et al. May 30, 2

Patent Grant D787814

U.S. patent number D787,814 [Application Number D/525,466] was granted by the patent office on 2017-05-30 for backpack. This patent grant is currently assigned to SZ DJI Technology Co., Ltd.. The grantee listed for this patent is SZ DJI TECHNOLOGY CO., LTD.. Invention is credited to Min Kim, Hai-Bin Zheng.


United States Patent D787,814
Kim ,   et al. May 30, 2017

Backpack

Claims

CLAIM The ornamental design for a backpack, as shown and described.
Inventors: Kim; Min (Shenzhen, CN), Zheng; Hai-Bin (Shenzhen, CN)
Applicant:
Name City State Country Type

SZ DJI TECHNOLOGY CO., LTD.

Shenzhen

N/A

CN
Assignee: SZ DJI Technology Co., Ltd. (Shenzhen, CN)
Appl. No.: D/525,466
Filed: April 29, 2015

Foreign Application Priority Data

Nov 13, 2014 [CN] 2014 3 0446106
Current U.S. Class: D3/217
Current International Class: 0301
Field of Search: ;D3/201,213-219,221,224,225,229,230,232,243-246,254,318

References Cited [Referenced By]

U.S. Patent Documents
D197546 February 1964 Motokane
D388610 January 1998 Horne
D660584 May 2012 Cross
D699944 February 2014 Mather
D708845 July 2014 Taylor
D709689 July 2014 Brunazzi
D726405 April 2015 Nassanian
Primary Examiner: Kirschbaum; George D
Assistant Examiner: Watkins; Jennifer
Attorney, Agent or Firm: Sterne, Kessler, Goldstein & Fox P.L.L.C.

Description



FIG. 1 is a perspective view of a backpack showing our design.

FIG. 2 is a front elevational view of the backpack of FIG. 1.

FIG. 3 is a rear elevational view of the backpack of FIG. 1.

FIG. 4 is a left-side elevational view of the backpack of FIG. 1.

FIG. 5 is a right-side elevational view of the backpack of FIG. 1.

FIG. 6 is a top plan view of the backpack of FIG. 1; and,

FIG. 7 is a bottom plan view of the backpack of FIG. 1.

The broken lines in the figures show portions of the backpack that form no part of the claimed design.

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