U.S. patent number D787,814 [Application Number D/525,466] was granted by the patent office on 2017-05-30 for backpack.
This patent grant is currently assigned to SZ DJI Technology Co., Ltd.. The grantee listed for this patent is SZ DJI TECHNOLOGY CO., LTD.. Invention is credited to Min Kim, Hai-Bin Zheng.
United States Patent |
D787,814 |
Kim , et al. |
May 30, 2017 |
Backpack
Claims
CLAIM The ornamental design for a backpack, as shown and described.
Inventors: |
Kim; Min (Shenzhen,
CN), Zheng; Hai-Bin (Shenzhen, CN) |
Applicant: |
Name |
City |
State |
Country |
Type |
SZ DJI TECHNOLOGY CO., LTD. |
Shenzhen |
N/A |
CN |
|
|
Assignee: |
SZ DJI Technology Co., Ltd.
(Shenzhen, CN)
|
Appl.
No.: |
D/525,466 |
Filed: |
April 29, 2015 |
Foreign Application Priority Data
|
|
|
|
|
Nov 13, 2014 [CN] |
|
|
2014 3 0446106 |
|
Current U.S.
Class: |
D3/217 |
Current International
Class: |
0301 |
Field of
Search: |
;D3/201,213-219,221,224,225,229,230,232,243-246,254,318 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Kirschbaum; George D
Assistant Examiner: Watkins; Jennifer
Attorney, Agent or Firm: Sterne, Kessler, Goldstein &
Fox P.L.L.C.
Description
FIG. 1 is a perspective view of a backpack showing our design.
FIG. 2 is a front elevational view of the backpack of FIG. 1.
FIG. 3 is a rear elevational view of the backpack of FIG. 1.
FIG. 4 is a left-side elevational view of the backpack of FIG.
1.
FIG. 5 is a right-side elevational view of the backpack of FIG.
1.
FIG. 6 is a top plan view of the backpack of FIG. 1; and,
FIG. 7 is a bottom plan view of the backpack of FIG. 1.
The broken lines in the figures show portions of the backpack that
form no part of the claimed design.
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