Headphone

Jaynes February 28, 2

Patent Grant D780154

U.S. patent number D780,154 [Application Number D/469,760] was granted by the patent office on 2017-02-28 for headphone. This patent grant is currently assigned to Wicked Audio, Inc.. The grantee listed for this patent is Stephen R. Jaynes. Invention is credited to Stephen R. Jaynes.


United States Patent D780,154
Jaynes February 28, 2017

Headphone

Claims

CLAIM The ornamental design for a headphone, as shown and described.
Inventors: Jaynes; Stephen R. (Pleasant Grove, UT)
Applicant:
Name City State Country Type

Jaynes; Stephen R.

Pleasant Grove

UT

US
Assignee: Wicked Audio, Inc. (Lindon, UT)
Appl. No.: D/469,760
Filed: October 14, 2013

Current U.S. Class: D14/205
Current International Class: 1401
Field of Search: ;D14/205,223 ;181/129,130,135 ;379/430,431 ;381/380,381 ;455/90.3,575.1 ;D29/112 ;24/113R,102PL,299.01,124.11 ;D11/202 ;D2/607,609 ;2/245,145

References Cited [Referenced By]

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Primary Examiner: Greene; Paula
Attorney, Agent or Firm: McConkie; Kirton Tingey; David B. Keller; Bryant J.

Description



FIG. 1 is a perspective view showing a representative embodiment of my new design;

FIG. 2 is a front elevation view of the embodiment shown in FIG. 1;

FIG. 3 is a back elevation view of the embodiment shown in FIG. 1;

FIG. 4 is a left, side elevation view of the embodiment shown in FIG. 1;

FIG. 5 is a right, side elevation view of the embodiment shown in FIG. 1;

FIG. 6 is a top plan view of the embodiment shown in FIG. 1;

FIG. 7 is a bottom plan view of the embodiment shown in FIG. 1;

FIG. 8 is a perspective view showing another representative embodiment of my new design;

FIG. 9 is a front elevation view of the embodiment shown in FIG. 8;

FIG. 10 is a back elevation view of the embodiment shown in FIG. 8;

FIG. 11 is a left, side elevation view of the embodiment shown in FIG. 8;

FIG. 12 is a right, side elevation view of the embodiment shown in FIG. 8;

FIG. 13 is a top plan view of the embodiment shown in FIG. 8;

FIG. 14 is a bottom plan view of the embodiment shown in FIG. 8;

FIG. 15 is a perspective view showing another representative embodiment of my new design;

FIG. 16 is a back elevation view of the embodiment shown in FIG. 15;

FIG. 17 is a front elevation view of the embodiment shown in FIG. 15;

FIG. 18 is a right, side elevation view of the embodiment shown in FIG. 15;

FIG. 19 is a left, side elevation view of the embodiment shown in FIG. 15;

FIG. 20 is a top plan view of the embodiment shown in FIG. 15; and,

FIG. 21 is a bottom plan view of the embodiment shown in FIG. 15.

Representative embodiments of optional support structures are shown in broken lines for illustration purposes only and form no part of the claimed design.

* * * * *


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