U.S. patent number D780,154 [Application Number D/469,760] was granted by the patent office on 2017-02-28 for headphone.
This patent grant is currently assigned to Wicked Audio, Inc.. The grantee listed for this patent is Stephen R. Jaynes. Invention is credited to Stephen R. Jaynes.
United States Patent |
D780,154 |
Jaynes |
February 28, 2017 |
Headphone
Claims
CLAIM The ornamental design for a headphone, as shown and
described.
Inventors: |
Jaynes; Stephen R. (Pleasant
Grove, UT) |
Applicant: |
Name |
City |
State |
Country |
Type |
Jaynes; Stephen R. |
Pleasant Grove |
UT |
US |
|
|
Assignee: |
Wicked Audio, Inc. (Lindon,
UT)
|
Appl.
No.: |
D/469,760 |
Filed: |
October 14, 2013 |
Current U.S.
Class: |
D14/205 |
Current International
Class: |
1401 |
Field of
Search: |
;D14/205,223
;181/129,130,135 ;379/430,431 ;381/380,381 ;455/90.3,575.1 ;D29/112
;24/113R,102PL,299.01,124.11 ;D11/202 ;D2/607,609 ;2/245,145 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
|
|
|
|
|
|
|
2006-086980 |
|
Mar 2006 |
|
JP |
|
WO 98/49867 |
|
Nov 1998 |
|
WO |
|
WO 2007/053743 |
|
May 2007 |
|
WO |
|
Primary Examiner: Greene; Paula
Attorney, Agent or Firm: McConkie; Kirton Tingey; David B.
Keller; Bryant J.
Description
FIG. 1 is a perspective view showing a representative embodiment of
my new design;
FIG. 2 is a front elevation view of the embodiment shown in FIG.
1;
FIG. 3 is a back elevation view of the embodiment shown in FIG.
1;
FIG. 4 is a left, side elevation view of the embodiment shown in
FIG. 1;
FIG. 5 is a right, side elevation view of the embodiment shown in
FIG. 1;
FIG. 6 is a top plan view of the embodiment shown in FIG. 1;
FIG. 7 is a bottom plan view of the embodiment shown in FIG. 1;
FIG. 8 is a perspective view showing another representative
embodiment of my new design;
FIG. 9 is a front elevation view of the embodiment shown in FIG.
8;
FIG. 10 is a back elevation view of the embodiment shown in FIG.
8;
FIG. 11 is a left, side elevation view of the embodiment shown in
FIG. 8;
FIG. 12 is a right, side elevation view of the embodiment shown in
FIG. 8;
FIG. 13 is a top plan view of the embodiment shown in FIG. 8;
FIG. 14 is a bottom plan view of the embodiment shown in FIG.
8;
FIG. 15 is a perspective view showing another representative
embodiment of my new design;
FIG. 16 is a back elevation view of the embodiment shown in FIG.
15;
FIG. 17 is a front elevation view of the embodiment shown in FIG.
15;
FIG. 18 is a right, side elevation view of the embodiment shown in
FIG. 15;
FIG. 19 is a left, side elevation view of the embodiment shown in
FIG. 15;
FIG. 20 is a top plan view of the embodiment shown in FIG. 15;
and,
FIG. 21 is a bottom plan view of the embodiment shown in FIG.
15.
Representative embodiments of optional support structures are shown
in broken lines for illustration purposes only and form no part of
the claimed design.
* * * * *