Electronic device
Kwak , et al. February 21, 2
U.S. patent number D779,447 [Application Number D/487,418] was granted by the patent office on 2017-02-21 for electronic device. This patent grant is currently assigned to SAMSUNG ELECTRONICS CO., LTD.. The grantee listed for this patent is Samsung Electronics Co., Ltd.. Invention is credited to Hyun-Jin Kim, Ji-Yeon Kwak, Kio Lee.
| United States Patent | D779,447 |
| Kwak , et al. | February 21, 2017 |
Electronic device
Claims
CLAIM The ornamental design for an electronic device, as shown and described.
| Inventors: | Kwak; Ji-Yeon (Seoul, KR), Lee; Kio (Seoul, KR), Kim; Hyun-Jin (Seoul, KR) | ||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
| Applicant: |
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| Assignee: | SAMSUNG ELECTRONICS CO., LTD.
(Gyeonggi-Do, KR) |
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| Appl. No.: | D/487,418 | ||||||||||
| Filed: | April 8, 2014 |
Foreign Application Priority Data
| Oct 10, 2013 [KR] | 30-2013-0051312 | |||
| Current U.S. Class: | D14/138G; D14/138AB |
| Current International Class: | 1403 |
| Field of Search: | ;D14/138G,159,496,203.3,356,480.7,138AD,138AA,240,248 ;D13/184 ;D10/75,106.1,104.1 ;455/566,575.1 ;439/136 ;353/122,173 ;345/581 ;361/679.1 |
References Cited [Referenced By]
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Other References
|
GSMrena: Samsung Omnia W 18350: Announced Oct. 2011, [Site Visited Aug. 15, 2016] http://www.gsmarena.com/samsung.sub.--omnia.sub.--w.sub.--i8350- -pictures-4200.php. cited by examiner . Bloomberg: Samsung to Release a Three Sided Phone During The Second Half of 2014 , Maybe, Announced Nov. 15, 2013 [Site Visited Aug. 15, 2016] http://www.androidbeat.com/2013/11/bloomberg-samsung-release-three-sided-- phone-second-half-2014-maybe/. cited by examiner . GSM: 10 Best Mid-Range Smart Phones for 2013, Announced Aug. 14, 2013 [Site visited Aug. 15, 2016] http://www.gsmreviews.net/10-best-mid-range-smart-phones-for-2013/. cited by examiner. |
Primary Examiner: Windmuller; John
Assistant Examiner: McNeil; Luqman
Attorney, Agent or Firm: Cantor Colburn LLP
Description
FIG. 1 is a perspective view of an electronic device, showing our new design;
FIG. 2 is a front elevation view thereof;
FIG. 3 is a rear elevation view thereof;
FIG. 4 is a side elevation view thereof;
FIG. 5 is another side elevation view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof; and,
FIG. 8 is another perspective view thereof.
The broken lines represent portions of the electronic device that form no part of the claimed design.
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References
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