Earphone
Hsieh , et al. December 27, 2
U.S. patent number D775,108 [Application Number D/539,913] was granted by the patent office on 2016-12-27 for earphone. This patent grant is currently assigned to 1MORE INC.. The grantee listed for this patent is 1MORE INC.. Invention is credited to Yingda Chen, Kuan-Hong Hsieh, Boqing Lin, Zheng Wei.
| United States Patent | D775,108 |
| Hsieh , et al. | December 27, 2016 |
Earphone
Claims
CLAIM The ornamental design for an earphone, as shown and described.
| Inventors: | Hsieh; Kuan-Hong (Shenzhen, CN), Lin; Boqing (Shenzhen, CN), Wei; Zheng (Shenzhen, CN), Chen; Yingda (Shenzhen, CN) | ||||||||||
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| Applicant: |
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| Assignee: | 1MORE INC. (Shenzhen,
CN) |
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| Appl. No.: | D/539,913 | ||||||||||
| Filed: | September 18, 2015 |
Foreign Application Priority Data
| Mar 27, 2015 [CN] | 2015 3 0077279 | |||
| Current U.S. Class: | D14/223 |
| Current International Class: | 1401 |
| Field of Search: | ;D14/223,205 ;181/129,130,135 ;379/430,431 ;381/380,381,370,199,420,69 ;455/90.3,569.1,575.1 |
References Cited [Referenced By]
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| 2013/0170692 | July 2013 | Kaneko |
Attorney, Agent or Firm: HoustonHogle LLP
Description
FIG. 1 is a front elevational view of an earphone showing a new design;
FIG. 2 is a rear elevational view thereof;
FIG. 3 is a left-side elevational view thereof;
FIG. 4 is a right-side elevational view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof; and,
FIG. 7 is a perspective view thereof.
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