Camera module

Walters , et al. December 20, 2

Patent Grant D774584

U.S. patent number D774,584 [Application Number D/478,551] was granted by the patent office on 2016-12-20 for camera module. This patent grant is currently assigned to FLIR Systems, Inc.. The grantee listed for this patent is FLIR Systems, Inc.. Invention is credited to Theodore R. Hoelter, Barbara Sharp, Michael D. Walters.


United States Patent D774,584
Walters ,   et al. December 20, 2016

Camera module

Claims

CLAIM The ornamental design for a camera module, as shown and described.
Inventors: Walters; Michael D. (San Jose, CA), Hoelter; Theodore R. (Goleta, CA), Sharp; Barbara (Santa Barbara, CA)
Applicant:
Name City State Country Type

FLIR Systems, Inc.

Wilsonville

OR

US
Assignee: FLIR Systems, Inc. (Wilsonville, OR)
Appl. No.: D/478,551
Filed: January 6, 2014

Current U.S. Class: D16/200
Current International Class: 1601
Field of Search: ;D16/200-204,208,218,219 ;340/932.2,933,937 ;348/143,148,151,373-376 ;396/419,427,428,537-541

References Cited [Referenced By]

U.S. Patent Documents
D489388 May 2004 Saito
D496062 September 2004 Yamakami
D496382 September 2004 Yamakami
D510376 October 2005 Yamakami
D511182 November 2005 Kato
D515610 February 2006 Yamakami
D564562 March 2008 Honma
D699775 February 2014 Li
D699776 February 2014 Li
2004/0130656 July 2004 Why
2013/0182179 July 2013 Page
2014/0168509 June 2014 Lee
Primary Examiner: Krakower; Susan E
Assistant Examiner: Almatrahi; Ramzi
Attorney, Agent or Firm: Haynes and Boone, LLP

Description



FIG. 1 is a top, front, and right side perspective view of a camera module showing our new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a bottom plan view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a front elevational view thereof;

FIG. 7 is a rear elevational view thereof;

FIG. 8 is a top, front, and right side perspective view of a camera module, shown within a socket depicted in broken lines to illustrate an environment;

FIG. 9 is a top, front, and right side perspective view of a camera module, shown with a circuit board depicted in broken lines to illustrate an environment;

FIG. 10 is a top plan view thereof;

FIG. 11 is a bottom plan view thereof;

FIG. 12 is a left side elevational view thereof;

FIG. 13 is a right side elevational view thereof;

FIG. 14 is a front elevational view thereof; and,

FIG. 15 is a rear elevational view thereof.

The broken lines showing a socket and a circuit board in FIGS. 8-15 represent environmental structure and form no part of the claimed design. The broken lines in FIGS. 1-7 depict portions of the camera module in which the design is embodied and form no part of the claimed design.

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