Light emitting diode package

Description

FIG. 1 is a perspective view of a light emitting diode package showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left-side, elevational view thereof;

FIG. 5 is a right-side, elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Claims

CLAIM The ornamental design for a light emitting diode package, as shown and described.

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Inventors:	Lin; Hou-Te (Hsinchu, TW), Chang; Chao-Hsiung (Hsinchu, TW), Chen; Pin-Chuan (Hsinchu, TW), Chen; Lung-Hsin (Hsinchu, TW)
Applicant:	Name City State Country Type ADVANCED OPTOELECTRONIC TECHNOLOGY, INC. Hsinchu Hsien N/A TW
Assignee:	ADVANCED OPTOELECTRONIC TECHNOLOGY, INC. (Hsinchu Hsien, TW)
Appl. No.:	D/522,885
Filed:	April 3, 2015

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Foreign Application Priority Data

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Jan 29, 2015 [CN]			2015 3 00279928

Current U.S. Class:	D13/180
Current International Class:	1303
Field of Search:	;D13/180 ;D26/1

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References Cited [Referenced By]

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U.S. Patent Documents

D495304	August 2004	Kim
D584246	January 2009	Low
D595244	June 2009	In
D595245	June 2009	Kim
D608309	January 2010	Kim
D640211	June 2011	Kokubu
8106406	January 2012	Liu
D660813	May 2012	Otaki
D676003	February 2013	Takeda
D693780	November 2013	Chen
D695239	December 2013	Ko
D698742	February 2014	Niikura
D712851	September 2014	Cai
D728491	May 2015	Nakabayashi
2010/0059782	March 2010	Fujitomo
2012/0286301	November 2012	Kobayakawa

Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: ScienBiziP, P.C.