Electronics package

Russo June 14, 2

Patent Grant D758841

U.S. patent number D758,841 [Application Number D/523,177] was granted by the patent office on 2016-06-14 for electronics package. This patent grant is currently assigned to GoPro, Inc.. The grantee listed for this patent is GoPro, Inc.. Invention is credited to Stephanie Russo.


United States Patent D758,841
Russo June 14, 2016

Electronics package

Claims

CLAIM The ornamental design for an electronics package, as shown and described.
Inventors: Russo; Stephanie (San Francisco, CA)
Applicant:
Name City State Country Type

GoPro, Inc.

San Mateo

CA

US
Assignee: GoPro, Inc. (San Mateo, CA)
Appl. No.: D/523,177
Filed: April 7, 2015

Current U.S. Class: D9/415
Current International Class: 0903
Field of Search: ;D9/414-419,432,499,722,703,669,721,423 ;206/776,474

References Cited [Referenced By]

U.S. Patent Documents
D349458 August 1994 Verdaguer
D383669 September 1997 Taylor
D384276 September 1997 Casey
D485172 January 2004 Defino, Jr.
D538676 March 2007 Millen
7243800 July 2007 Feibelman
D561580 February 2008 Croft
D564872 March 2008 Kamins
D592053 May 2009 Suzuki
D633381 March 2011 Klauder
D652321 January 2012 Melnick
D668141 October 2012 Collins
D668535 October 2012 Collins
D671400 November 2012 Armstrong
D671401 November 2012 Grabes
D671829 December 2012 Sung
D681444 May 2013 Oja
D684457 June 2013 Salow
D691464 October 2013 Lee
8607987 December 2013 Oja
D699562 February 2014 Klauder
D703036 April 2014 Baumwald
D703530 April 2014 Caldecourt
D717160 November 2014 Kurniawan
D721597 January 2015 Zumwalt
D740690 October 2015 Glass
D747960 January 2016 Sculler
D749964 February 2016 Glass
Primary Examiner: Baynham; Holly
Assistant Examiner: Shields; Rhea
Attorney, Agent or Firm: Fenwick & West LLP

Description



FIG. 1 is a front, top and left side perspective view of an electronics package showing our my design;

FIG. 2 is a rear, top, and left side perspective view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a left side elevational view thereof;

FIG. 7 is a top plan view thereof;

FIG. 8 is a bottom plan view thereof;

FIG. 9 is a front elevational view thereof; and,

FIG. 10 is a rear elevational view thereof.

The broken lines in the drawings showing portions of the electronics package are included for the purpose of illustrating environmental structure and form no part of the claimed design.

* * * * *


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