U.S. patent number D757,663 [Application Number D/489,894] was granted by the patent office on 2016-05-31 for light emitting diode chip. This patent grant is currently assigned to Formosa Epitaxy Incorporation. The grantee listed for this patent is Formosa Epitaxy Incorporation. Invention is credited to Hui-Ching Feng.
United States Patent | D757,663 |
Feng | May 31, 2016 |
Inventors: | Feng; Hui-Ching (Taoyuan County, TW) | ||||||||||
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Applicant: |
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Assignee: | Formosa Epitaxy Incorporation
(Taoyuan, TW) |
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Appl. No.: | D/489,894 | ||||||||||
Filed: | May 5, 2014 |
Jan 28, 2014 [TW] | 103300560 | |||
Current U.S. Class: | D13/180 |
Current International Class: | 1303 |
Field of Search: | ;D13/180 ;D21/486,501,503 ;D25/152,155,160,163 ;D26/1 |
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