Light emitting diode chip

Description

FIG. 1 is a perspective view of a light emitting diode chip showing a embodiment of my new design;

FIG. 2 is a front view of the embodiment;

FIG. 3 is a rear view of the embodiment;

FIG. 4 is a left side view of the embodiment;

FIG. 5 is a right side view of the embodiment;

FIG. 6 is a top view of the embodiment; and,

FIG. 7 is a bottom view of the embodiment.

The broken line portions of the light emitting diode chip in FIGS. 1-7 represent unclaimed portions of the design and form no part thereof.

Claims

CLAIM The ornamental design for a light emitting diode chip, as shown and described.

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Inventors:	Feng; Hui-Ching (Taoyuan County, TW)
Applicant:	Name City State Country Type Formosa Epitaxy Incorporation Taoyuan County N/A TW
Assignee:	Formosa Epitaxy Incorporation (Taoyuan, TW)
Appl. No.:	D/489,894
Filed:	May 5, 2014

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Foreign Application Priority Data

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Jan 28, 2014 [TW]			103300560

Current U.S. Class:	D13/180
Current International Class:	1303
Field of Search:	;D13/180 ;D21/486,501,503 ;D25/152,155,160,163 ;D26/1

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References Cited [Referenced By]

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Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Jianq Chyun IP Office