Notebook ultrasonic module

Description

FIG. 1 is a front side perspective view of a notebook ultrasonic module showing my new design;

FIG. 2 is another side perspective view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a right side elevational view thereof;

FIG. 7 is a top plan view thereof; and,

FIG. 8 is a bottom plan view thereof.

Claims

CLAIM The ornamental design for a notebook ultrasonic module, as shown and described.

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Inventors:	Zhang; Renfu (Guangdong, CN), Xia; Chunhong (Guangdong, CN), Xiao; Shunjin (Guangdong, CN)
Applicant:	Name City State Country Type Edan Instruments, Inc. Shenzhen, Guangdong N/A CN
Assignee:	Edan Instruments, Inc. (Shenzhen, Guangdong Province, CN)
Appl. No.:	D/507,700
Filed:	October 30, 2014

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Foreign Application Priority Data

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Aug 29, 2014 [CN]			2014 3 0317087

Current U.S. Class:	D14/439; D14/432
Current International Class:	1402
Field of Search:	;D14/300-302,308-313,314,348,353-355,432,439-446,240 ;361/679.02,679.31,679.5,690,694,679.23,801,802 ;312/332.1,334.1 ;D13/162 ;D10/50

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References Cited [Referenced By]

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U.S. Patent Documents

D377482	January 1997	Geck
D421428	March 2000	Wu
D474185	May 2003	Goto
D485562	January 2004	Goto
D491189	June 2004	Williams
D496039	September 2004	Kerrigan
D565573	April 2008	Alo
D589517	March 2009	Chien
D594009	June 2009	Nakano
D742887	November 2015	Ignomirello
D743404	November 2015	Ignomirello
2004/0017651	January 2004	Gan

Primary Examiner: Murphy; Austin
Attorney, Agent or Firm: PROI Intellectual Property US