U.S. patent number D754,619 [Application Number D/489,896] was granted by the patent office on 2016-04-26 for light emitting diode chip.
This patent grant is currently assigned to Formosa Epitaxy Incorporation. The grantee listed for this patent is Formosa Epitaxy Incorporation. Invention is credited to Hui-Ching Feng.
United States Patent |
D754,619 |
Feng |
April 26, 2016 |
Light emitting diode chip
Claims
CLAIM The ornamental design for a light emitting diode chip, as
shown and described.
Inventors: |
Feng; Hui-Ching (Taoyuan
County, TW) |
Applicant: |
Name |
City |
State |
Country |
Type |
Formosa Epitaxy Incorporation |
Taoyuan County |
N/A |
TW |
|
|
Assignee: |
Formosa Epitaxy Incorporation
(Taoyuan, TW)
|
Appl.
No.: |
D/489,896 |
Filed: |
May 5, 2014 |
Foreign Application Priority Data
|
|
|
|
|
Jan 28, 2014 [TW] |
|
|
103300559 |
|
Current U.S.
Class: |
D13/180 |
Current International
Class: |
1303 |
Field of
Search: |
;D13/180
;D21/486,501,503 ;D25/152,155,160,163 ;D26/1 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
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|
|
|
|
|
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3005294750002 |
|
Jun 2009 |
|
KR |
|
D127765 |
|
Mar 2009 |
|
TW |
|
Other References
"Office Action of Taiwan Counterpart Application," issued on Jun.
25, 2015, p. 1-p. 3. cited by applicant.
|
Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Jianq Chyun IP Office
Description
FIG. 1 is a perspective view of a light emitting diode chip showing
a embodiment of my new design;
FIG. 2 is a front view of the embodiment;
FIG. 3 is a rear view of the embodiment;
FIG. 4 is a left side view of the embodiment;
FIG. 5 is a right side view of the embodiment;
FIG. 6 is a top view of the embodiment; and,
FIG. 7 is a bottom view of the embodiment.
The broken line portions of the light emitting diode chip in FIGS.
1-7 represent unclaimed portions of the design and form no part
thereof.
* * * * *