Headphones

Lee , et al. January 12, 2

Patent Grant D747290

U.S. patent number D747,290 [Application Number D/513,324] was granted by the patent office on 2016-01-12 for headphones. This patent grant is currently assigned to Monster LLC. The grantee listed for this patent is Monster, LLC. Invention is credited to Yiu Siu Fong, Kendrew Lee, Noel Lee.


United States Patent D747,290
Lee ,   et al. January 12, 2016

Headphones

Claims

CLAIM The ornamental design for headphones, as shown and described.
Inventors: Lee; Noel (Las Vegas, NV), Lee; Kendrew (Hong Kong, CN), Fong; Yiu Siu (Hong Kong, CN)
Applicant:
Name City State Country Type

Monster, LLC

Las Vegas

NV

US
Assignee: Monster LLC (Las Vegas, NV)
Appl. No.: D/513,324
Filed: December 30, 2014

Current U.S. Class: D14/205
Current International Class: 1401
Field of Search: ;D14/205 ;D29/112 ;2/209 ;181/129,130,135 ;379/430,431 ;381/380,381,374

References Cited [Referenced By]

U.S. Patent Documents
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2149341 March 1939 Harrison
3505684 April 1970 Hutchinson et al.
3787899 January 1974 Krawagna
D292205 October 1987 Kikutani
D318053 July 1991 Ludeke et al.
5033094 July 1991 Hung
D430140 August 2000 Roman
D484485 December 2003 Matsuoka
D534155 December 2006 Obata
D540301 April 2007 Obata
D563382 March 2008 Wikel
D625705 October 2010 Ohori et al.
D632668 February 2011 Brunner et al.
D652406 January 2012 Lee et al.
D657344 April 2012 Brunner et al.
D657776 April 2012 Lee et al.
D671914 December 2012 Lee et al.
D673518 January 2013 Tan
D673520 January 2013 Tan
D675595 February 2013 Cho et al.
D677647 March 2013 Lee et al.
D683329 May 2013 Hagelin
D684559 June 2013 Groset et al.
D691984 October 2013 Wang
D694216 November 2013 Lee et al.
D696643 December 2013 Lee et al.
D720721 January 2015 Lu
D731457 June 2015 Brunner et al.
D732000 June 2015 Brunner et al.
D732503 June 2015 Brunner et al.
D732504 June 2015 Funayama
Primary Examiner: Greene; Paula
Attorney, Agent or Firm: Nielsen; John Sentinel IP

Description



FIG. 1 is a perspective view of the headphones, showing the new design;

FIG. 2 is a front view of the left headphone, and a rear view of the right headphone;

FIG. 3 is a rear view of the left headphone, and a front view of the right headphone;

FIG. 4 is a side view of the headphones;

FIG. 5 is an opposing side view of the headphones;

FIG. 6 is a top view of the headphones; and,

FIG. 7 is a bottom view of the headphones.

The broken lines in the drawings are for illustrative purposes only and form no part of the claimed design.

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