U.S. patent number D738,043 [Application Number D/497,108] was granted by the patent office on 2015-09-01 for skin removal device. This patent grant is currently assigned to SOFT LINES INTERNATIONAL, LTD.. The grantee listed for this patent is Soft Lines International, Ltd.. Invention is credited to Wai Wah Yiu.
United States Patent | D738,043 |
Yiu | September 1, 2015 |
Inventors: | Yiu; Wai Wah (Kowloon, HK) | ||||||||||
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Applicant: |
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Assignee: | SOFT LINES INTERNATIONAL, LTD.
(Kowloon, HK) |
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Appl. No.: | D/497,108 | ||||||||||
Filed: | July 21, 2014 |
Application Number | Filing Date | Patent Number | Issue Date | ||
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29456966 | Jun 5, 2013 | D709650 | |||
29444220 | Jan 28, 2013 | D686370 | |||
29408409 | Dec 12, 2011 | D678614 | |||
Current U.S. Class: | D28/58; D28/59; D28/44.1 |
Current International Class: | 2803 |
Field of Search: | ;132/73,73.5-73.6,75.3,75.6,75.8,76.4-76.5 ;D28/56-62,49-54,44.1 ;30/43.92,34.1,26 ;D24/146-146,133 ;606/131-134 ;607/88 |
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US. Appl. No. 29/488,296, filed Apr. 17, 2014, Soft Lines International, Ltd. cited by applicant . U.S. Appl. No. 29/488,301, filed Apr. 17, 2014, Soft Lines International, Ltd. cited by applicant . U.S. Appl. No. 29/497,602, filed Jul. 25, 2014, Soft Lines International, Ltd. cited by applicant . U.S. Appl. No. 29/501,546, filed Sep. 5, 2014, Soft Lines International, Ltd. cited by applicant . U.S. Appl. No. 29/502,870, filed Sep. 19, 2014, Soft Lines International, Ltd. cited by applicant. |
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