U.S. patent number D709,650 [Application Number D/456,966] was granted by the patent office on 2014-07-22 for skin removal device. This patent grant is currently assigned to Soft Lines International, Ltd.. The grantee listed for this patent is Soft Lines International, Ltd.. Invention is credited to Wai Wah Yiu.
United States Patent | D709,650 |
Yiu | July 22, 2014 |
Inventors: | Yiu; Wai Wah (Kowloon, HK) | ||||||||||
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Applicant: |
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Assignee: | Soft Lines International, Ltd.
(Kowloon, HK) |
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Appl. No.: | D/456,966 | ||||||||||
Filed: | June 5, 2013 |
Application Number | Filing Date | Patent Number | Issue Date | ||
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29444220 | Jan 28, 2013 | D686370 | |||
29408409 | Dec 12, 2011 | D678614 | |||
Current U.S. Class: | D28/62; D28/59; D28/58 |
Current International Class: | 2803 |
Field of Search: | ;132/73,73.5-73.6,75.3,75.6,75.8,76.4-76.5 ;D28/56-59,49-54,62 ;30/43.92,34.1,26 ;D24/146,133 ;606/131-134 ;607/88 |
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