Sensor housing

Dispenza , et al. September 1, 2

Patent Grant D737698

U.S. patent number D737,698 [Application Number D/472,052] was granted by the patent office on 2015-09-01 for sensor housing. This patent grant is currently assigned to FLIR Systems, Inc.. The grantee listed for this patent is FLIR Systems, Inc.. Invention is credited to Jace Dispenza, Michael Kent, Zhenmei Mao, Patrick B. Richardson.


United States Patent D737,698
Dispenza ,   et al. September 1, 2015

Sensor housing

Claims

CLAIM The ornamental design for a sensor housing, as shown and described.
Inventors: Dispenza; Jace (Santa Barbara, CA), Kent; Michael (Santa Barbara, CA), Richardson; Patrick B. (Santa Barbara, CA), Mao; Zhenmei (Shanghai, CN)
Applicant:
Name City State Country Type

FLIR Systems, Inc.

Wilsonville

OR

US
Assignee: FLIR Systems, Inc. (Wilsonville, OR)
Appl. No.: D/472,052
Filed: November 7, 2013

Current U.S. Class: D10/53; D16/203
Current International Class: 1601
Field of Search: ;D10/53 ;D16/200-203,208,218 ;348/143,151,373-376 ;396/535-541

References Cited [Referenced By]

U.S. Patent Documents
D340253 October 1993 Fedorczak
D388450 December 1997 Hamano et al.
D399517 October 1998 Hasegawa
D402677 December 1998 Hiraguchi
6525766 February 2003 Ikoma et al.
D473888 April 2003 Jones et al.
D486509 February 2004 Suzuki
D489742 May 2004 Nagai
D502196 February 2005 Miyazaki
D517585 March 2006 Iino et al.
D518080 March 2006 Uehara
D536357 February 2007 Koby
D542319 May 2007 Ishida et al.
D545860 July 2007 Miyazaki
D550738 September 2007 Hsia
D552148 October 2007 Yamakawa et al.
D552650 October 2007 Yamakawa et al.
D556803 December 2007 Ishida
D562870 February 2008 Komatsu et al.
D574870 August 2008 Takahashi
D579474 October 2008 Yoo et al.
7435019 October 2008 Lee
7446813 November 2008 Nakamoto et al.
D583845 December 2008 Hayashi et al.
D608811 January 2010 Frank et al.
D609732 February 2010 Frank et al.
D627815 November 2010 Oba
D676477 February 2013 Chen et al.
2008/0267611 October 2008 Huang
Primary Examiner: Aronovich; Adir
Attorney, Agent or Firm: Haynes and Boone, LLP

Description



FIG. 1 is a front left top perspective view of a sensor housing showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a is a right side elevational view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

The broken lines depict the portions of a sensor housing in which the design is embodied and form no part of the claimed design.

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