U.S. patent number D736,660 [Application Number D/485,047] was granted by the patent office on 2015-08-18 for vibration sensor.
This patent grant is currently assigned to Sony Corporation. The grantee listed for this patent is Sony Corporation. Invention is credited to Yasuhide Hosoda, Tatsuhiro Obara, Shinji Yamamura.
United States Patent |
D736,660 |
Hosoda , et al. |
August 18, 2015 |
Vibration sensor
Claims
CLAIM The ornamental design for a vibration sensor, as shown and
described.
Inventors: |
Hosoda; Yasuhide (Kanagawa,
JP), Yamamura; Shinji (Chiba, JP), Obara;
Tatsuhiro (Chiba, JP) |
Applicant: |
Name |
City |
State |
Country |
Type |
Sony Corporation |
Tokyo |
N/A |
JP |
|
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Assignee: |
Sony Corporation (Tokyo,
JP)
|
Appl.
No.: |
D/485,047 |
Filed: |
March 14, 2014 |
Foreign Application Priority Data
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Dec 27, 2013 [CN] |
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2013 3 0650941 |
Dec 27, 2013 [JP] |
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D2013-030973 |
Dec 27, 2013 [JP] |
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D2013-030974 |
Dec 27, 2013 [JP] |
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D2013-030975 |
Dec 27, 2013 [JP] |
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D2013-030976 |
Dec 27, 2013 [JP] |
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D2013-030977 |
Dec 27, 2013 [JP] |
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D2013-030978 |
Dec 27, 2013 [JP] |
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D2013-030979 |
Dec 27, 2013 [JP] |
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D2013-030980 |
Dec 27, 2013 [JP] |
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D2013-030981 |
Dec 27, 2013 [JP] |
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D2013-030982 |
Dec 27, 2013 [JP] |
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D2013-030983 |
Dec 27, 2013 [JP] |
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D2013-030984 |
Dec 27, 2013 [JP] |
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D2013-030985 |
Dec 27, 2013 [JP] |
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D2013-030986 |
Dec 27, 2013 [JP] |
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D2013-030987 |
Dec 27, 2013 [JP] |
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D2013-030988 |
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Current U.S.
Class: |
D10/83 |
Current International
Class: |
1004 |
Field of
Search: |
;D10/83-85 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
Other References
Final Decision of the Board of Appeal issued in Japanese
Application No. D2013-030975, dated May 22, 2015. cited by
applicant.
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Primary Examiner: Davis; Antoine D
Attorney, Agent or Firm: Fishman Stewart Yamaguchi PLLC
Description
FIG. 1 is a perspective view of a first embodiment of a vibration
sensor showing our new design;
FIG. 2 is a front elevational view thereof.
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof;
FIG. 8 is a perspective view of a second embodiment of a vibration
sensor showing our new design;
FIG. 9 is a front elevational view thereof;
FIG. 10 is a rear elevational view thereof;
FIG. 11 is a left side elevational view thereof;
FIG. 12 is a right side elevational view thereof;
FIG. 13 is a top plan view thereof; and
FIG. 14 is a bottom plan view thereof.
FIG. 15 is a perspective view of a third embodiment of a vibration
sensor showing our new design;
FIG. 16 is a front elevational view thereof;
FIG. 17 is a rear elevational view thereof;
FIG. 18 is a left side elevational view thereof;
FIG. 19 is a right side elevational view thereof;
FIG. 20 is a top plan view thereof; and,
FIG. 21 is a bottom plan view thereof.
The broken lines showing in the drawings illustrate unclaimed
portions of the vibration sensor and form no part of the claimed
design.
* * * * *