Outer tube for process tube for manufacturing semiconductor wafers

Description

FIG. 1 is perspective view of an outer tube for process tube for manufacturing semiconductor wafers showing our new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a right side thereof;

FIG. 5 is a left side view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof; and,

FIG. 8 is a cross-sectional view taken along line 8-8 of FIG. 6.

The broken lines shown in the drawings represent portions of the outer tube for process tube for manufacturing semiconductor wafers that form no part of the claimed design.

Claims

CLAIM The ornamental design for an outer tube for process tube for manufacturing semiconductor wafers, as shown and described.

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Inventors:	Kaneko; Hirofumi (Oshu, JP), Endo; Atsushi (Nirasaki, JP)
Applicant:	Name City State Country Type Kaneko; Hirofumi Endo; Atsushi Oshu Nirasaki N/A N/A JP JP
Assignee:	Tokyo Electron Limited (Minato-Ku, JP)
Appl. No.:	D/420,534
Filed:	May 10, 2012

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Foreign Application Priority Data

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Nov 18, 2011 [JP]			2011-026684

Current U.S. Class:	D13/182
Current International Class:	1303
Field of Search:	;D13/182 ;D23/266 ;D7/600.1,600.2 ;118/715,722,724,725 ;219/385,390,486,520,523 ;83/35,39 ;138/118,118.1,121,177,178 ;206/454,711 ;211/41.18 ;414/935 ;432/247,253

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References Cited [Referenced By]

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Primary Examiner: Oswecki; Elizabeth J
Attorney, Agent or Firm: Burr & Brown, PLLC