Mobile phone case
Wen November 4, 2
U.S. patent number D716,784 [Application Number D/455,867] was granted by the patent office on 2014-11-04 for mobile phone case. This patent grant is currently assigned to Shenzhen Hello Tech Energy Co., Ltd.. The grantee listed for this patent is Shenzhen Hello Tech Energy Co., Ltd.. Invention is credited to Meichan Wen.
| United States Patent | D716,784 |
| Wen | November 4, 2014 |
Mobile phone case
Claims
CLAIM The ornamental design for a mobile phone case, as shown.
| Inventors: | Wen; Meichan (Shenzhen, CN) | ||||||||||
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| Applicant: |
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| Assignee: | Shenzhen Hello Tech Energy Co.,
Ltd. (Shenzhen, CN) |
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| Appl. No.: | D/455,867 | ||||||||||
| Filed: | May 24, 2013 |
| Current U.S. Class: | D14/250 |
| Current International Class: | 1403 |
| Field of Search: | ;D14/250,137,138AA,217,238.1,248,251,252,253,346,440,496,356 ;D13/107,108 ;455/575.1,575.8,95,93 ;220/4.02 ;206/305,320,251,45.2 |
References Cited [Referenced By]
U.S. Patent Documents
| D561092 | February 2008 | Kim |
| D653202 | January 2012 | Hasbrook et al. |
| D663263 | July 2012 | Gupta et al. |
| D664091 | July 2012 | Pliner et al. |
| D667783 | September 2012 | Zhang et al. |
| D670689 | November 2012 | Wang |
| D671493 | November 2012 | Hasbrook et al. |
| D674394 | January 2013 | Kajimoto |
| D676432 | February 2013 | Hasbrook et al. |
| D679271 | April 2013 | Liu |
| D679684 | April 2013 | Baker et al. |
| D682196 | May 2013 | Leung |
| D686152 | July 2013 | Lee et al. |
| 8560014 | October 2013 | Hu et al. |
| D703650 | April 2014 | Ehrlich |
| D703651 | April 2014 | Ehrlich |
| 2012/0088558 | April 2012 | Song |
| 2013/0045775 | February 2013 | Heywood |
Assistant Examiner: Bekic; Lilyana
Attorney, Agent or Firm: Hann; James F. Haynes Beffel & Wolfeld LLP
Description
FIG. 1 is a front elevational view of a mobile phone case showing my new design;
FIG. 2 is a rear elevational view thereof;
FIG. 3 is a left-side elevational view thereof;
FIG. 4 is a right-side elevational view thereof;
FIG. 5 is a top plan view thereof; and,
FIG. 6 is a bottom plan view thereof.
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