Mobile phone

Hibi September 16, 2

Patent Grant D713373

U.S. patent number D713,373 [Application Number D/460,837] was granted by the patent office on 2014-09-16 for mobile phone. This patent grant is currently assigned to Sony Mobile Communications AB. The grantee listed for this patent is Sony Mobile Communications AB. Invention is credited to Keita Hibi.


United States Patent D713,373
Hibi September 16, 2014

Mobile phone

Claims

CLAIM The ornamental design for a mobile phone, as shown and described.
Inventors: Hibi; Keita (Tokyo, JP)
Applicant:
Name City State Country Type

Sony Mobile Communications AB

Lund

N/A

SE
Assignee: Sony Mobile Communications AB (Lund, SE)
Appl. No.: D/460,837
Filed: July 16, 2013

Related U.S. Patent Documents

Application Number Filing Date Patent Number Issue Date
29444013 Jan 25, 2013 D712368

Foreign Application Priority Data

Mar 22, 2013 [EM] 002207787
Current U.S. Class: D14/138G
Current International Class: 1403
Field of Search: ;D14/138R,138AD,138AC,138C,138G,137,341-347,247-248 ;455/566,575.1,575.3,575.4

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D677234 March 2013 Hirano
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Foreign Patent Documents
D155825 Sep 2013 TW
D156534 Oct 2013 TW

Other References

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Primary Examiner: Eland; Bridget L
Attorney, Agent or Firm: Renner, Otto, Boisselle & Sklar, LLP

Description



FIG. 1 is a perspective view of a mobile phone showing my new design.

FIG. 2 is a front view thereof.

FIG. 3 is a rear view thereof.

FIG. 4 is a left side view thereof

FIG. 5 is a right side view thereof.

FIG. 6 is a top view thereof; and,

FIG. 7 is a bottom view thereof.

* * * * *

References


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