U.S. patent number D713,373 [Application Number D/460,837] was granted by the patent office on 2014-09-16 for mobile phone. This patent grant is currently assigned to Sony Mobile Communications AB. The grantee listed for this patent is Sony Mobile Communications AB. Invention is credited to Keita Hibi.
United States Patent | D713,373 |
Hibi | September 16, 2014 |
Inventors: | Hibi; Keita (Tokyo, JP) | ||||||||||
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Applicant: |
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Assignee: | Sony Mobile Communications AB
(Lund, SE) |
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Appl. No.: | D/460,837 | ||||||||||
Filed: | July 16, 2013 |
Application Number | Filing Date | Patent Number | Issue Date | ||
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29444013 | Jan 25, 2013 | D712368 | |||
Mar 22, 2013 [EM] | 002207787 | |||
Current U.S. Class: | D14/138G |
Current International Class: | 1403 |
Field of Search: | ;D14/138R,138AD,138AC,138C,138G,137,341-347,247-248 ;455/566,575.1,575.3,575.4 |
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