Heat pad

Description

FIG. 1 is a perspective view of a first embodiment of a heat pad showing our new design;

FIG. 2 is a front elevation plan view thereof;

FIG. 3 is a rear elevation view thereof;

FIG. 4 is a sectional view along the line 4-4 in FIG. 2;

FIG. 5 is a front elevation view thereof showing a first mode in use; and,

FIG. 6 is a front elevation view thereof showing a second mode in use.

The broken line environmental showing is for illustrative purposes only and does not form part of the claimed design.

Claims

CLAIM The ornamental design for a heat pad, as shown and described.

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Inventors:	Ogaki; Mitsuko (Tokyo, JP), Nitanai; Yuichi (Tokyo, JP)
Applicant:	Name City State Country Type Ogaki; Mitsuko Nitanai; Yuichi Tokyo Tokyo N/A N/A JP JP
Assignee:	Lotte Co., Ltd. (Tokyo, JP)
Appl. No.:	D/404,102
Filed:	October 14, 2011

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Foreign Application Priority Data

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Apr 15, 2011 [JP]			2011-008753
Apr 15, 2011 [JP]			2011-008754

Current U.S. Class:	D24/200
Current International Class:	2401
Field of Search:	;126/263.01,263.03 ;182/230 ;602/41,48,54-58 ;607/104,108-114 ;D6/582-583,596,601 ;D9/707 ;D24/189,200,206-207 ;D14/440

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Other References

iPad Case, imore.com, Apr. 3, 2010 http://www.imore.com/ipad-accessories-preorder-save-10. cited by examiner . The Apple iPad 2 Review, Brian Klug et al., AnandTech, Mar. 19, 2011 http://www.anandtech.com/show/4225/the-ipad-2-review/10. cited by examiner . Notification of Reason(s) for Refusal (with its English-language partial translation), mailed on Apr. 19, 2013, issued in connection with the Priority Japanese patent application No. 2011-8753. cited by applicant . Notification of Reason(s) for Refusal (with its English-language partial translation) mailed on Apr. 19, 2013, issued in connection with the Priority Japanese patent application No. 2011-8754. cited by applicant.

Primary Examiner: Goodman; Eric
Assistant Examiner: Reickel; John
Attorney, Agent or Firm: Rabin & Berdo, P.C.