Heat pipe cooling device

Kitajima , et al. September 9, 2

Patent Grant D713020

U.S. patent number D713,020 [Application Number D/371,467] was granted by the patent office on 2014-09-09 for heat pipe cooling device. This patent grant is currently assigned to Hitachi Power Solutions Co., Ltd.. The grantee listed for this patent is Hironori Kitajima, Hitoshi Sakayori, Yuuzou Shiraishi. Invention is credited to Hironori Kitajima, Hitoshi Sakayori, Yuuzou Shiraishi.


United States Patent D713,020
Kitajima ,   et al. September 9, 2014

Heat pipe cooling device

Claims

CLAIM The ornamental design for a heat pipe cooling device, substantially as shown and described.
Inventors: Kitajima; Hironori (Tsuchiura, JP), Sakayori; Hitoshi (Tsukuba, JP), Shiraishi; Yuuzou (Tsuchiura, JP)
Applicant:
Name City State Country Type

Kitajima; Hironori
Sakayori; Hitoshi
Shiraishi; Yuuzou

Tsuchiura
Tsukuba
Tsuchiura

N/A
N/A
N/A

JP
JP
JP
Assignee: Hitachi Power Solutions Co., Ltd. (Hitachi-shi, Ibaraki, JP)
Appl. No.: D/371,467
Filed: March 9, 2011

Foreign Application Priority Data

Sep 10, 2010 [JP] 2010-021910
Nov 10, 2010 [JP] 2010-027000
Dec 28, 2010 [JP] 2010-031223
Current U.S. Class: D23/322
Current International Class: 2303
Field of Search: ;D23/322,323,335,411,499,370,377 ;D13/197 ;174/15.1,16.3 ;361/690,697,702,709,711,514

References Cited [Referenced By]

U.S. Patent Documents
5412535 May 1995 Chao et al.
D511327 November 2005 Ma et al.
D567772 April 2008 Lin et al.
7455102 November 2008 Cheng
2007/0144710 June 2007 Cheng
2007/0246189 October 2007 Lin et al.
Primary Examiner: Nelson; T. Chase
Assistant Examiner: Aman; Ania
Attorney, Agent or Firm: McGinn IP Law Group, PLLC

Description



FIG. 1 is a front view of the heat pipe cooling device showing our new design;

FIG. 2 is a plan view thereof;

FIG. 3 is a bottom view thereof;

FIG. 4 is a right side view thereof;

FIG. 5 is a left side view thereof;

FIG. 6 is a back view thereof; and,

FIG. 7 is a cross sectional view thereof, taken along line XIV-XIV in FIG. 4.

This article is a heat pipe cooling device, which is configured to cool a semiconductor device or the like to be used for a vehicle control apparatus and the like. This article comprises a heat block configured to contact the semiconductor device or the like, a plurality of heat pipes, and a plurality of heat dissipation fins connected by the heat pipes. This article is configured such that heat is transferred from the semiconductor device or the like to the heat block, then transferred from the heat block to the heat dissipation fins through the heat pipes, and finally dissipated from the heat dissipation fins.

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