U.S. patent number D713,020 [Application Number D/371,467] was granted by the patent office on 2014-09-09 for heat pipe cooling device.
This patent grant is currently assigned to Hitachi Power Solutions Co., Ltd.. The grantee listed for this patent is Hironori Kitajima, Hitoshi Sakayori, Yuuzou Shiraishi. Invention is credited to Hironori Kitajima, Hitoshi Sakayori, Yuuzou Shiraishi.
United States Patent |
D713,020 |
Kitajima , et al. |
September 9, 2014 |
Heat pipe cooling device
Claims
CLAIM The ornamental design for a heat pipe cooling device,
substantially as shown and described.
Inventors: |
Kitajima; Hironori (Tsuchiura,
JP), Sakayori; Hitoshi (Tsukuba, JP),
Shiraishi; Yuuzou (Tsuchiura, JP) |
Applicant: |
Name |
City |
State |
Country |
Type |
Kitajima; Hironori
Sakayori; Hitoshi
Shiraishi; Yuuzou |
Tsuchiura
Tsukuba
Tsuchiura |
N/A
N/A
N/A |
JP
JP
JP |
|
|
Assignee: |
Hitachi Power Solutions Co.,
Ltd. (Hitachi-shi, Ibaraki, JP)
|
Appl.
No.: |
D/371,467 |
Filed: |
March 9, 2011 |
Foreign Application Priority Data
|
|
|
|
|
Sep 10, 2010 [JP] |
|
|
2010-021910 |
Nov 10, 2010 [JP] |
|
|
2010-027000 |
Dec 28, 2010 [JP] |
|
|
2010-031223 |
|
Current U.S.
Class: |
D23/322 |
Current International
Class: |
2303 |
Field of
Search: |
;D23/322,323,335,411,499,370,377 ;D13/197 ;174/15.1,16.3
;361/690,697,702,709,711,514 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Nelson; T. Chase
Assistant Examiner: Aman; Ania
Attorney, Agent or Firm: McGinn IP Law Group, PLLC
Description
FIG. 1 is a front view of the heat pipe cooling device showing our
new design;
FIG. 2 is a plan view thereof;
FIG. 3 is a bottom view thereof;
FIG. 4 is a right side view thereof;
FIG. 5 is a left side view thereof;
FIG. 6 is a back view thereof; and,
FIG. 7 is a cross sectional view thereof, taken along line XIV-XIV
in FIG. 4.
This article is a heat pipe cooling device, which is configured to
cool a semiconductor device or the like to be used for a vehicle
control apparatus and the like. This article comprises a heat block
configured to contact the semiconductor device or the like, a
plurality of heat pipes, and a plurality of heat dissipation fins
connected by the heat pipes. This article is configured such that
heat is transferred from the semiconductor device or the like to
the heat block, then transferred from the heat block to the heat
dissipation fins through the heat pipes, and finally dissipated
from the heat dissipation fins.
* * * * *