Light emitting diode (LED) package

Abare , et al. July 22, 2

Patent Grant D709464

U.S. patent number D709,464 [Application Number D/423,422] was granted by the patent office on 2014-07-22 for light emitting diode (led) package. This patent grant is currently assigned to Cree, Inc.. The grantee listed for this patent is Amber C. Abare, Jeffrey Carl Britt, Joseph G. Clark, Raymond Rosado, Harsh Sundani. Invention is credited to Amber C. Abare, Jeffrey Carl Britt, Joseph G. Clark, Raymond Rosado, Harsh Sundani.


United States Patent D709,464
Abare ,   et al. July 22, 2014

Light emitting diode (LED) package

Claims

CLAIM The ornamental design for a light emitting diode (LED) package, as shown and described.
Inventors: Abare; Amber C. (Durham, NC), Britt; Jeffrey Carl (Cary, NC), Clark; Joseph G. (Raleigh, NC), Rosado; Raymond (Apex, NC), Sundani; Harsh (Raleigh, NC)
Applicant:
Name City State Country Type

Abare; Amber C.
Britt; Jeffrey Carl
Clark; Joseph G.
Rosado; Raymond
Sundani; Harsh

Durham
Cary
Raleigh
Apex
Raleigh

NC
NC
NC
NC
NC

US
US
US
US
US
Assignee: Cree, Inc. (Durham, NC)
Appl. No.: D/423,422
Filed: May 31, 2012

Current U.S. Class: D13/180
Current International Class: 1303
Field of Search: ;D13/180 ;D26/1 ;257/79,80,81,88,89,95,98,99,100,E33.058 ;313/483,498,500 ;362/555,800

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Foreign Patent Documents
201230586339.6 Jul 2013 CN
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Other References

Restriction Requirement for U.S. Appl. No. 13/554,776 dated Jun. 14, 2013. cited by applicant .
Chinese Office Action for Application No. 201330248426.5 dated Aug. 19, 2013. cited by applicant .
Chinese Notice of Grant for Application No. 201230586339.6 dated Apr. 15, 2013. cited by applicant .
"High Flux Density and Efficacy," Luxeon M Datasheet DSI03, 2012, pp. 1-22, Philips Lumileds Company, United States. cited by applicant .
Shchekin, Oleg et al., "Evolutionary new chip design targets lighting systems," Compound Semiconductor, Mar. 2007, vol. 13 No. 2, Institute of Physics Publishing and IOP Publishing Ltd. cited by applicant .
International Search Report and Written Opinion for Application No. PCT/US2013/043618 dated Sep. 25, 2013. cited by applicant .
International Search Report and Written Opinion for Application No. PCT/US2013/043619 dated Sep. 26, 2013. cited by applicant .
Restriction Requirement for Design U.S. Appl. No. 29/439,629 dated Sep. 30, 2013. cited by applicant .
Notice of Issurance for Application No. 201330248426.5 dated Nov. 19, 2013. cited by applicant .
Notice of Allowance for Design U.S. Appl. No. 29/439,629 dated Nov. 27, 2013. cited by applicant .
Chinese Office Action for Application No. 201330525231.0 dated Jan. 13, 2014. cited by applicant.

Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Jenkins, Wilson, Taylor & Hunt, P.A.

Description



FIG. 1 is a top perspective view of a LED package showing our design according to a first embodiment;

FIG. 2 is a top plan view thereof;

FIG. 3 is a bottom plan view thereof, opposite the view of FIG. 2;

FIG. 4 is a first side view thereof;

FIG. 5 is a second side view thereof;

FIG. 6 is a third side view thereof, opposite the view of FIG. 4;

FIG. 7 is a fourth side view thereof, opposite the view of FIG. 5;

FIG. 8 is a top perspective view of a LED package showing our design according to a second embodiment;

FIG. 9 is a top plan view thereof;

FIG. 10 is a bottom plan view thereof, opposite the view of FIG. 9;

FIG. 11 is a first side view thereof;

FIG. 12 is a second side view thereof;

FIG. 13 is a third side view thereof, opposite the view of FIG. 11;

FIG. 14 is a fourth side view thereof, opposite the view of FIG. 12;

FIG. 15 is a top perspective view of a LED package showing our design according to a third embodiment;

FIG. 16 is a top plan view;

FIG. 17 is a bottom plan view;

FIG. 18 is first side view;

FIG. 19 is second side view;

FIG. 20 is third side view;

FIG. 21 is fourth side view;

FIG. 22 is a top perspective view of a LED package showing our design according to a fourth embodiment;

FIG. 23 is a top plan view;

FIG. 24 is a bottom plan view;

FIG. 25 is first side view;

FIG. 26 is second side view;

FIG. 27 is third side view; and,

FIG. 28 is fourth side view.

The broken lines are for illustrative purposes only and form no part of the claimed design. The stippled portion of the embodiment illustrated in FIGS. 8, 9, 11, and 13 represent that the stippled portion is a different material than other, adjacent portions. The more densely stippled portions illustrated in FIGS. 22, 23, and 25-28 represent a metallic surface.

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