U.S. patent number D708,154 [Application Number D/381,111] was granted by the patent office on 2014-07-01 for light emitting diode.
This patent grant is currently assigned to Nichia Corporation. The grantee listed for this patent is Hideki Hayashi. Invention is credited to Hideki Hayashi.
United States Patent |
D708,154 |
Hayashi |
July 1, 2014 |
Light emitting diode
Claims
CLAIM The ornamental design for a light emitting diode, as shown
and described.
Inventors: |
Hayashi; Hideki (Komatsushima,
JP) |
Applicant: |
Name |
City |
State |
Country |
Type |
Hayashi; Hideki |
Komatsushima |
N/A |
JP |
|
|
Assignee: |
Nichia Corporation
(JP)
|
Appl.
No.: |
D/381,111 |
Filed: |
December 15, 2010 |
Related U.S. Patent Documents
|
|
|
|
|
|
|
Application
Number |
Filing Date |
Patent Number |
Issue Date |
|
|
29343390 |
Sep 11, 2009 |
D635526 |
|
|
|
Foreign Application Priority Data
|
|
|
|
|
Mar 13, 2009 [JP] |
|
|
2009-005677 |
|
Current U.S.
Class: |
D13/180 |
Current International
Class: |
1303 |
Field of
Search: |
;D13/180 ;D26/1,2
;257/79,80,81,88,89,95,98,99,100,E33.058 ;313/483,498,500
;362/555,800 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
|
|
|
|
|
|
|
D1349177 |
|
Jan 2009 |
|
JP |
|
D1349178 |
|
Jan 2009 |
|
JP |
|
D1349692 |
|
Jan 2009 |
|
JP |
|
D1349693 |
|
Jan 2009 |
|
JP |
|
D1349694 |
|
Jan 2009 |
|
JP |
|
D1349695 |
|
Jan 2009 |
|
JP |
|
D1361917 |
|
Jun 2009 |
|
JP |
|
D1361918 |
|
Jun 2009 |
|
JP |
|
Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: SAIDMAN DesignLaw Group
Description
FIG. 1 is a front, bottom and left side perspective view a light
emitting diode showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof;
FIG. 6 is a right side elevational view thereof; and,
FIG. 7 is a left side elevational view thereof.
The broken lines illustrate portions of the light emitting diode
and form no part of the claimed design.
* * * * *