Flip-cover for an electronic device
Weng May 27, 2
U.S. patent number D705,783 [Application Number D/440,414] was granted by the patent office on 2014-05-27 for flip-cover for an electronic device. This patent grant is currently assigned to Huizhou TCL Mobile Communication Co., Ltd. The grantee listed for this patent is Jie Weng. Invention is credited to Jie Weng.
| United States Patent | D705,783 |
| Weng | May 27, 2014 |
Flip-cover for an electronic device
Claims
CLAIM The ornamental design for a flip-cover for an electronic device, as shown and described.
| Inventors: | Weng; Jie (Huizhou, CN) | ||||||||||
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| Applicant: |
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| Assignee: | Huizhou TCL Mobile Communication
Co., Ltd (Huizhou, CN) |
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| Appl. No.: | D/440,414 | ||||||||||
| Filed: | December 21, 2012 |
| Current U.S. Class: | D14/440 |
| Current International Class: | 1402 |
| Field of Search: | ;D14/138G,250,251,253,240,217,496,440,203.3,203.4,203.5,203.8,341,318,345 ;D3/218,215,201,269,273,294,289,303,327,900 ;D21/469 ;220/4.02 ;248/309.1 ;361/679.56 ;379/426,433.11,455 ;455/575.1,575.8 ;190/100 ;206/305,320 |
References Cited [Referenced By]
U.S. Patent Documents
| D657354 | April 2012 | Kim |
| D658187 | April 2012 | Diebel |
| D658188 | April 2012 | Diebel |
| D671948 | December 2012 | Akana et al. |
| D674799 | January 2013 | Kim |
| D674800 | January 2013 | Kim |
| D682838 | May 2013 | Akana et al. |
| D685799 | July 2013 | Canizares et al. |
| D685800 | July 2013 | Canizares et al. |
| D685801 | July 2013 | Canizares et al. |
| D685802 | July 2013 | Canizares et al. |
| D689055 | September 2013 | Snyder |
| D690702 | October 2013 | Chung |
| D694741 | December 2013 | Kim |
| D695745 | December 2013 | Kim |
| 2012/0085679 | April 2012 | Kim et al. |
| 2012/0322518 | December 2012 | Kim |
Assistant Examiner: Bekic; Lilyana
Attorney, Agent or Firm: Anova Law Group, PLLC
Description
FIG. 1 is a perspective view of flip-cover for an electronic device in accordance with the present invention
FIG. 2 is a front view of FIG. 1;
FIG. 3 is a rear view of FIG. 1;
FIG. 4 is a top view of FIG. 1;
FIG. 5 is a bottom view of FIG. 1;
FIG. 6 is a left side view of FIG. 1; and,
FIG. 7 is a right side view of FIG. 1.
In one embodiment, the dimension for the flip-cover is approximately 105.times.139.times.2.5 mm.
In one embodiment, the flip-cover the flip-cover includes a metal connecting piece and a leather cover.
In one embodiment, the flip-cover the flip-cover includes a metal connecting piece with a thickness of 2.5 mm and a leather cover with a thickness of 2 mm.
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