U.S. patent number D697,047 [Application Number D/421,448] was granted by the patent office on 2014-01-07 for headphone.
This patent grant is currently assigned to Sony Corporation. The grantee listed for this patent is Shigenori Yoshida. Invention is credited to Shigenori Yoshida.
United States Patent |
D697,047 |
Yoshida |
January 7, 2014 |
Headphone
Claims
CLAIM The ornamental design for a headphone, as shown and
described.
Inventors: |
Yoshida; Shigenori (Tokyo,
JP) |
Applicant: |
Name |
City |
State |
Country |
Type |
Yoshida; Shigenori |
Tokyo |
N/A |
JP |
|
|
Assignee: |
Sony Corporation (Tokyo,
JP)
|
Appl.
No.: |
D/421,448 |
Filed: |
July 30, 2012 |
Current U.S.
Class: |
D14/205 |
Current International
Class: |
1401 |
Field of
Search: |
;D14/205,206,215,216,217,218,219 ;D29/112 ;2/209
;181/129,130,135,136 ;379/430,431 ;381/380,381 ;455/90.3,575.1 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Greene; Paula
Attorney, Agent or Firm: Rader, Fishman & Grauer
PLLC
Description
FIG. 1 is a perspective view of a headphone showing my new
design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof; and
FIG. 7 is a bottom plan view thereof.
FIG. 8 is a perspective view of another embodiment of a headphone
showing my new design;
FIG. 9 is a front elevational view thereof;
FIG. 10 is a rear elevational view thereof;
FIG. 11 is a left side elevational view thereof;
FIG. 12 is a right side elevational view thereof; and
FIG. 13 is a top plan view thereof; and,
FIG. 14 is a bottom plan view thereof.
The broken lines form no part of the claimed design.
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