U.S. patent number D696,166 [Application Number D/412,752] was granted by the patent office on 2013-12-24 for rear bumper for automobiles.
This patent grant is currently assigned to Honda Motor Co., Ltd.. The grantee listed for this patent is Yasuo Imagawa. Invention is credited to Yasuo Imagawa.
United States Patent |
D696,166 |
Imagawa |
December 24, 2013 |
Rear bumper for automobiles
Claims
CLAIM The ornamental design for a rear bumper for automobiles, as
shown and described.
Inventors: |
Imagawa; Yasuo (Wako,
JP) |
Applicant: |
Name |
City |
State |
Country |
Type |
Imagawa; Yasuo |
Wako |
N/A |
JP |
|
|
Assignee: |
Honda Motor Co., Ltd. (Tokyo,
JP)
|
Appl.
No.: |
D/412,752 |
Filed: |
February 7, 2012 |
Foreign Application Priority Data
|
|
|
|
|
Aug 8, 2011 [JP] |
|
|
2011-018169 |
|
Current U.S.
Class: |
D12/169 |
Current International
Class: |
1216 |
Field of
Search: |
;D12/86,90,91,92,163,169,171,196,216 ;293/102,113,115,117,120
;296/180.1,180.2 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Hyder; Philip S
Assistant Examiner: Ly; Darlington
Attorney, Agent or Firm: Plumsea Law Group, LLC
Description
FIG. 1 is an elevational view of a rear bumper for automobiles
showing my new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a side elevational view thereof, the opposite side
elevational view being a mirror image; and,
FIG. 4 is a perspective view thereof.
The broken line showings form no part of the claimed design.
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