U.S. patent number D695,261 [Application Number D/421,495] was granted by the patent office on 2013-12-10 for headphone.
This patent grant is currently assigned to Sony Corporation. The grantee listed for this patent is Kenji Katsumata. Invention is credited to Kenji Katsumata.
United States Patent |
D695,261 |
Katsumata |
December 10, 2013 |
Headphone
Claims
CLAIM The ornamental design for a headphone, as shown and
described.
Inventors: |
Katsumata; Kenji (Tokyo,
JP) |
Applicant: |
Name |
City |
State |
Country |
Type |
Katsumata; Kenji |
Tokyo |
N/A |
JP |
|
|
Assignee: |
Sony Corporation (Tokyo,
JP)
|
Appl.
No.: |
D/421,495 |
Filed: |
August 1, 2012 |
Foreign Application Priority Data
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|
|
|
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Feb 2, 2012 [CN] |
|
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2012 3 0020981 |
|
Current U.S.
Class: |
D14/205 |
Current International
Class: |
1401 |
Field of
Search: |
;D14/205,206
;181/129,130,135 ;379/430,431 ;381/380,381 ;455/90.3,575.1 ;D29/112
;2/209 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
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D1337863 |
|
Aug 2008 |
|
JP |
|
D1366080 |
|
Aug 2009 |
|
JP |
|
D1411701 |
|
Apr 2011 |
|
JP |
|
Primary Examiner: Greene; Paula
Attorney, Agent or Firm: Rader, Fishman & Grauer
PLLC
Description
FIG. 1 is a perspective view of a first embodiment of a headphone
showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof; and
FIG. 7 is a bottom plan view thereof.
FIG. 8 is a perspective view of a second embodiment of a headphone
showing my new design;
FIG. 9 is a front elevational view thereof;
FIG. 10 is a rear elevational view thereof;
FIG. 11 is a left side elevational view thereof;
FIG. 12 is a right side elevational view thereof;
FIG. 13 is a top plan view thereof; and
FIG. 14 is a bottom plan view thereof.
FIG. 15 is a perspective view of a third embodiment of a headphone
showing my new design;
FIG. 16 is a front elevational view thereof;
FIG. 17 is a rear elevational view thereof;
FIG. 18 is a left side elevational view thereof;
FIG. 19 is a right side elevational view thereof;
FIG. 20 is a top plan view thereof; and
FIG. 21 is a bottom plan view thereof.
FIG. 22 is a perspective view of a fourth embodiment of a headphone
showing my new design;
FIG. 23 is a front elevational view thereof;
FIG. 24 is a rear elevational view thereof;
FIG. 25 is a left side elevational view thereof;
FIG. 26 is a right side elevational view thereof;
FIG. 27 is a top plan view thereof; and,
FIG. 28 is a bottom plan view thereof.
Portions shown as broken lines are for illustrative purposes only
and form no part of the claimed design. Dot-dash broken lines
define the boundaries of, but not included in, the claimed
design.
* * * * *