Heat dissipating device

Description

FIG. 1 is a perspective view of a heat dissipating device showing my new design.

FIG. 2 is a front elevational view of the heat dissipating device.

FIG. 3 is a rear elevational view of the heat dissipating device.

FIG. 4 is a left-side, elevational view of the heat dissipating device.

FIG. 5 is a right-side, elevational view of the heat dissipating device.

FIG. 6 is a top plan view of the heat dissipating device.

FIG. 7 is a bottom plan view of the heat dissipating device; and,

FIG. 8 is another perspective view of the heat dissipating device, showing a heat pipe interconnecting the heat dissipating device and a base, wherein the heat pipe and the base are shown in broken lines for illustrative environmental purposes only and form no part of the claimed design.

Claims

CLAIM The ornamental design for a heat dissipating device, as shown and described.

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Inventors:	Lin; Yu-Ching (New Taipei, TW)
Applicant:	Name City State Country Type Foxconn Technology Co., Ltd. New Taipei N/A TW
Assignee:	Foxconn Technology Co., Ltd. (New Taipei, TW)
Appl. No.:	D/438,467
Filed:	November 30, 2012

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Current U.S. Class:	D13/179
Current International Class:	1303
Field of Search:	;D13/179 ;165/80.3,104.26,104.33,122,151,185 ;257/706,707,718-722 ;361/695,697,700,702,704,709,710,711,719

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References Cited [Referenced By]

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U.S. Patent Documents

6751097	June 2004	Lin et al.
7679907	March 2010	Kaneko
7913749	March 2011	Meng et al.
7952872	May 2011	Hata et al.
8233277	July 2012	Yang
8379383	February 2013	Sugiura et al.
2006/0039113	February 2006	Cheng et al.
2008/0011461	January 2008	Hwang et al.
2008/0105410	May 2008	Hwang et al.
2008/0156460	July 2008	Hwang et al.
2009/0229791	September 2009	Hung et al.
2010/0238628	September 2010	Hung et al.
2011/0030923	February 2011	Liang et al.
2011/0080710	April 2011	Sugiura et al.
2012/0320526	December 2012	Wang et al.

Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Chung; Wei Te Chang; Ming Chieh