U.S. patent number D692,331 [Application Number D/429,412] was granted by the patent office on 2013-10-29 for in-wall passive infrared occupancy sensor.
This patent grant is currently assigned to Wenzhou MTLC Electric Appliances Co. Ltd.. The grantee listed for this patent is Wei Gao, Lidong Ni. Invention is credited to Wei Gao, Lidong Ni.
United States Patent |
D692,331 |
Ni , et al. |
October 29, 2013 |
In-wall passive infrared occupancy sensor
Claims
CLAIM The ornamental design for an in-wall passive infrared
occupancy sensor, as shown and described.
Inventors: |
Ni; Lidong (Yueqing,
CN), Gao; Wei (Yueqing, CN) |
Applicant: |
Name |
City |
State |
Country |
Type |
Ni; Lidong
Gao; Wei |
Yueqing
Yueqing |
N/A
N/A |
CN
CN |
|
|
Assignee: |
Wenzhou MTLC Electric Appliances
Co. Ltd. (Yueqing, Zhejiang, CN)
|
Appl.
No.: |
D/429,412 |
Filed: |
August 10, 2012 |
Current U.S.
Class: |
D10/70 |
Current International
Class: |
1004 |
Field of
Search: |
;D10/65,70,75,78,97,106.1-106.8
;D14/138R,138AA,138AB,138AC,138AD,341-347,507-510,136,167,168,496,498,499,500,125-134,239,371,374-377,440,450,448,336,342
;343/702 ;345/87,104,133,156,168,173,901-905,165
;348/180,184,315,739,836,838,325 ;364/444,499
;701/408-418,431,432,537 ;312/7.2 ;341/12 ;720/605,669,600,655
;369/99,197 ;455/344,347,575.1
;250/221,338.3,340,239,342,341,DIG.1,353 ;307/116,117
;340/521,527,541,567,540,568.2,539.23,635,687 ;315/159
;324/72.5,556,133,149,503,543,555,66,72,754,115,141,522
;73/615,624,627,644,514.33,514.34,510,513,527,530 ;356/3.01-5.15
;235/105 ;377/5,24.2,26
;702/155,160,176,78,79,82,91-95,104,116,141,150,151,154,127,131,182,183,189
;600/437,443,453,459,465,479,500,502,595,485,481,483 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Davis; Antoine D
Attorney, Agent or Firm: Ziegler IP Law Group, LLC.
Description
FIG. 1 is a perspective view of one embodiment of the sensor
showing the new design.
FIG. 2 is a front view of the embodiment shown in FIG. 1.
FIG. 3 is a left side view of the embodiment shown in FIG. 1.
FIG. 4 is a right side view of the embodiment shown in FIG. 1.
FIG. 5 is a top view of the embodiment shown in FIG. 1.
FIG. 6 is a bottom view of the embodiment shown in FIG. 1.
FIG. 7 is a back view of the embodiment shown in FIG. 1.
FIG. 8 is a perspective view of another embodiment of the sensor
showing the new design.
FIG. 9 is a front view of the embodiment shown in FIG. 8.
FIG. 10 is a left side view of the embodiment shown in FIG. 8.
FIG. 11 is a right side view of the embodiment shown in FIG. 8.
FIG. 12 is a top view of the embodiment shown in FIG. 8.
FIG. 13 is a bottom view of the embodiment shown in FIG. 8.
FIG. 14 is a back view of the embodiment shown in FIG. 8.
FIG. 15 is a perspective view of another embodiment of the sensor
showing the new design.
FIG. 16 is a front view of the embodiment shown in FIG. 15.
FIG. 17 is a left side view of the embodiment shown in FIG. 15.
FIG. 18 is a right side view of the embodiment shown in FIG.
15.
FIG. 19 is a top view of the embodiment shown in FIG. 15.
FIG. 20 is a bottom view of the embodiment shown in FIG. 15.
FIG. 21 is a back view of the embodiment shown in FIG. 15.
FIG. 22 is a perspective view of another embodiment of the sensor
showing the new design.
FIG. 23 is a front view of the embodiment shown in FIG. 22.
FIG. 24 is a left side view of the embodiment shown in FIG. 22.
FIG. 25 is a right side view of the embodiment shown in FIG.
22.
FIG. 26 is a top view of the embodiment shown in FIG. 22.
FIG. 27 is a bottom view of the embodiment shown in FIG. 22;
and,
FIG. 28 is a back view of the embodiment shown in FIG. 22.
The broken lines are for the purpose of illustrating portions of
the environment and form no part of the claimed design.
* * * * *