Pressure sensor package

Description

FIG. 1 is a front, top and right side perspective of the pressure sensor package showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Claims

CLAIM The ornamental design for a pressure sensor package, as shown and described.

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Inventors:	Okawa; Hisanobu (Tokyo, JP), Ishida; Hiroshi (Tokyo, JP), Hattori; Yasuyuki (Tokyo, JP), Nishimizu; Takashi (Tokyo, JP), Kamimura; Hideki (Tokyo, JP)
Applicant:	Name City State Country Type Okawa; Hisanobu Ishida; Hiroshi Hattori; Yasuyuki Nishimizu; Takashi Kamimura; Hideki Tokyo Tokyo Tokyo Tokyo Tokyo N/A N/A N/A N/A N/A JP JP JP JP JP
Assignee:	Alps Electric Co., Ltd. (Tokyo, JP)
Appl. No.:	D/415,518
Filed:	March 12, 2012

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Foreign Application Priority Data

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Sep 14, 2011 [JP]			2011-020968

Current U.S. Class:	D10/85
Current International Class:	1004
Field of Search:	;D10/83-85 ;73/706,715,716,717,723,725,756,721,727,754 ;257/415,417,692,E21.506,E29.324,E21.002,E21.499,E23.004,E23.066,E29.141 ;439/51,617

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References Cited [Referenced By]

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U.S. Patent Documents

5465626	November 1995	Brown et al.
7659551	February 2010	Loh
8196476	June 2012	Kurtz et al.
D669804	October 2012	Ashino
8304847	November 2012	Kaminaga et al.
8368112	February 2013	Chan et al.
8405200	March 2013	Ueda
2003/0214026	November 2003	Tokuhara
2004/0118214	June 2004	McDonald et al.
2010/0199777	August 2010	Hooper et al.
2012/0168884	July 2012	Yao et al.
2013/0127879	May 2013	Burns et al.

Primary Examiner: Davis; Antoine D
Attorney, Agent or Firm: Saliwanchik, Lloyd & Eisenschenk