U.S. patent number D688,470 [Application Number D/410,945] was granted by the patent office on 2013-08-27 for synthetic resin sheet.
This patent grant is currently assigned to Samsung Electronics Co., Ltd.. The grantee listed for this patent is Hong Jidam, Hea Me Lee. Invention is credited to Hong Jidam, Hea Me Lee.
United States Patent |
D688,470 |
Jidam , et al. |
August 27, 2013 |
Synthetic resin sheet
Claims
CLAIM We claim the ornamental design for a synthetic resin sheet,
as shown and described.
Inventors: |
Jidam; Hong (Seoul,
KR), Lee; Hea Me (Seoul, KR) |
Applicant: |
Name |
City |
State |
Country |
Type |
Jidam; Hong
Lee; Hea Me |
Seoul
Seoul |
N/A
N/A |
KR
KR |
|
|
Assignee: |
Samsung Electronics Co., Ltd.
(Gyeonggi-do, KR)
|
Appl.
No.: |
D/410,945 |
Filed: |
January 13, 2012 |
Current U.S.
Class: |
D5/58 |
Current International
Class: |
0506 |
Field of
Search: |
;D5/4,7,11,43,47,50,53-59,61-63,99 ;D6/582,602,612,613,617,622
;D24/124-126 ;D32/40 ;4/581 ;5/402,490,495 ;15/208,215 ;112/401,402
;139/383B,383R,416,420B,420R,428 ;162/111,116,134,140,416 ;245/2
;428/32,37,39,57,66.5,79,85,181,221,542.6 ;442/181,320,327
;604/385.01 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Acker; Karen S
Attorney, Agent or Firm: Harness, Dickey & Pierce,
P.L.C.
Description
FIG. 1 is a first image of a synthetic resin sheet showing our new
design; and,
FIG. 2 shows the design of FIG. 1 in a position of use.
The broken lines represent environmental subject matter and
portions of the synthetic sheet that form no part of the claim. The
thickness of the synthetic resin sheet forms no part of the claim.
The broken line showing of the bounds of the claimed design form no
part thereof. The synthetic resin sheet does not include
perforations.
* * * * *