U.S. patent number D687,698 [Application Number D/402,037] was granted by the patent office on 2013-08-13 for sensor mount assembly.
This patent grant is currently assigned to SMC Corporation. The grantee listed for this patent is Mitsuru Machijima, Kunihiro Suzuki. Invention is credited to Mitsuru Machijima, Kunihiro Suzuki.
United States Patent |
D687,698 |
Machijima , et al. |
August 13, 2013 |
Sensor mount assembly
Claims
CLAIM The ornamental design for a sensor mount assembly, as shown
and described.
Inventors: |
Machijima; Mitsuru
(Tsukubamirai, JP), Suzuki; Kunihiro (Tsukubamirai,
JP) |
Applicant: |
Name |
City |
State |
Country |
Type |
Machijima; Mitsuru
Suzuki; Kunihiro |
Tsukubamirai
Tsukubamirai |
N/A
N/A |
JP
JP |
|
|
Assignee: |
SMC Corporation (Chiyoda-ku,
Tokyo, JP)
|
Appl.
No.: |
D/402,037 |
Filed: |
September 20, 2011 |
Foreign Application Priority Data
|
|
|
|
|
May 24, 2011 [JP] |
|
|
2011-011633 |
|
Current U.S.
Class: |
D8/354 |
Current International
Class: |
0805 |
Field of
Search: |
;D8/349,354,380,382,366,363,371,373,376
;248/300,237,309.1,200,205.1,207,214,235,247,351,220.41,224.8,229.25,239.12,73,229.1,224.51,224.61,316.1,313
;52/188,182,191,702,712,745.06,189,506.5,586.1 ;29/428,525.01,464
;249/14,205,208 ;403/167,169,362 ;211/86.01,90.01,105.1,193,134
;108/152 ;40/642.02 ;D12/400,223,159 ;D15/21,28 ;200/237-238,275
;361/810,807 ;91/50 ;24/339 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Goodwin; Mark
Attorney, Agent or Firm: Yokoi & Co., U.S.A., Inc.
Yokoi; Toshiyuki
Description
FIG. 1 shows a front view of a sensor mount assembly showing my new
design;
FIG. 2 shows a rear view thereof;
FIG. 3 shows a right side view thereof;
FIG. 4 shows a left side view thereof;
FIG. 5 shows a top view thereof;
FIG. 6 shows a bottom view thereof;
FIG. 7 shows a top, front and left side perspective view
thereof;
FIG. 8 shows a top, front and left side exploded perspective view
thereof to illustrate a mounting member and a sensor folder
separately;
FIG. 9 shows a bottom view thereof with the sensor folder removed
to illustrate the bottom surface of the mounting member;
FIG. 10 shows a cross-sectional view thereof, taken along line
10-10 in FIG. 5; and,
FIG. 11 shows a reduced scale top, front and left side perspective
view thereof in use with a cylinder and a sensor.
The cylinder and the sensor shown in broken lines in FIG. 11 are
for the purpose of illustrating the environment only and form no
part of the claimed design.
* * * * *