U.S. patent number D684,130 [Application Number D/422,058] was granted by the patent office on 2013-06-11 for electronics enclosure.
This patent grant is currently assigned to GE Intelligent Platforms, Inc.. The grantee listed for this patent is Kenneth Wayne Crawford, Vinson R Epperson, Laith Anthony Vincent. Invention is credited to Kenneth Wayne Crawford, Vinson R Epperson, Laith Anthony Vincent.
United States Patent |
D684,130 |
Vincent , et al. |
June 11, 2013 |
Electronics enclosure
Claims
CLAIM The ornamental design for an electronics enclosure, as shown
and described.
Inventors: |
Vincent; Laith Anthony
(Charlottesville, VA), Crawford; Kenneth Wayne
(Charlottesville, VA), Epperson; Vinson R (Ruckersville,
VA) |
Applicant: |
Name |
City |
State |
Country |
Type |
Vincent; Laith Anthony
Crawford; Kenneth Wayne
Epperson; Vinson R |
Charlottesville
Charlottesville
Ruckersville |
VA
VA
VA |
US
US
US |
|
|
Assignee: |
GE Intelligent Platforms, Inc.
(Charlottesville, VA)
|
Appl.
No.: |
D/422,058 |
Filed: |
May 16, 2012 |
Current U.S.
Class: |
D13/184 |
Current International
Class: |
1303 |
Field of
Search: |
;D14/300,301,308,314,348,349-356,358 ;D13/162,184,199
;312/223.1-223.2 ;360/99.01-99.12 ;369/34.01,36.01
;361/679.01,679.6,679.22 ;345/173 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Nunn; Freda S
Attorney, Agent or Firm: Global Patent Operation Conklin;
Mark A.
Description
FIG. 1 is a perspective view of our design;
FIG. 2 is a top plan view of the embodiment of FIG. 1;
FIG. 3 is a side elevational view of the embodiment of FIG. 1, the
opposite side being a mirror image thereof;
FIG. 4 is a front elevational view of the embodiment of FIG. 1;
FIG. 5 is a back view of the embodiment of FIG. 1;
FIG. 6 is a perspective view of a second embodiment of our
design;
FIG. 7 is a top plan view of the embodiment of FIG. 6;
FIG. 8 is a side elevational view of the embodiment of FIG. 6, the
opposite side being a mirror image thereof;
FIG. 9 is a front view of the embodiment of FIG. 6;
FIG. 10 is a back view of the embodiment of FIG. 6;
FIG. 11 is a perspective view of a third embodiment of our
design;
FIG. 12 is a top plan view of the embodiment of FIG. 11;
FIG. 13 is a side elevational view of the embodiment of FIG. 11,
the opposite side being a mirror image thereof;
FIG. 14 is a front view of the embodiment of FIG. 11; and,
FIG. 15 is a back view of the embodiment of FIG. 11.
Broken lines shown in the drawings illustrate portions of the
electronics enclosure, and form no part of the claimed design.
* * * * *