LED package

Description

FIG. 1 is a perspective view of a "LED package" showing my new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a top view thereof;

FIG. 7 is a bottom view thereof; and

FIG. 8 is a perspective view viewed from another visual angle thereof; and,

FIG. 9 is a perspective view with a LED chip showing the practical usage thereof.

The dashed lines in the drawings are for illustrative purpose only and form no part of the claimed design.

Claims

CLAIM The ornamental design for a "LED package," as shown and described.

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Inventors:	Lin; Chen-Hsiu (New Taipei, TW), Chang; Yi-Chien (Taipei, TW)
Applicant:	Name City State Country Type Lin; Chen-Hsiu Chang; Yi-Chien New Taipei Taipei N/A N/A TW TW
Assignee:	Silitek Electronic (Guangzhou) Co., Ltd. (Guangzhou, CN) Lite-On Technology Corporation (Taipei, TW)
Appl. No.:	D/417,104
Filed:	March 30, 2012

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Current U.S. Class:	D13/180
Current International Class:	1303
Field of Search:	;D13/180 ;D26/1,2 ;257/79,80,81,88,89,95,98,99,100,E33.058 ;313/483,498,500 ;362/555,800

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References Cited [Referenced By]

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U.S. Patent Documents

D624032	September 2010	Takeuchi et al.
D637565	May 2011	Wu et al.
D644190	August 2011	Shimizu et al.
D644191	August 2011	Shimizu et al.
D646643	October 2011	Wu et al.
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D649943	December 2011	Kuwaharada et al.
D650343	December 2011	Andrews et al.
D658139	April 2012	Andrews et al.
2009/0108281	April 2009	Keller et al.
2010/0117099	May 2010	Leung
2010/0123144	May 2010	Chao
2011/0062482	March 2011	Solomensky et al.
2011/0210346	September 2011	Chen et al.
2011/0220920	September 2011	Collins et al.
2011/0227105	September 2011	Hwu et al.
2011/0248289	October 2011	Hsieh et al.
2012/0068198	March 2012	Andrews et al.
2012/0074443	March 2012	Li et al.
2012/0086024	April 2012	Andrews et al.
2012/0193651	August 2012	Edmond et al.
2012/0193659	August 2012	Andrews et al.

Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Li & Cai Intellectual Propery (USA) Office