U.S. patent number D674,366 [Application Number D/396,050] was granted by the patent office on 2013-01-15 for wafer holding member.
This patent grant is currently assigned to Tokyo Electron Limited. The grantee listed for this patent is Hideki Kajiwara. Invention is credited to Hideki Kajiwara.
United States Patent |
D674,366 |
Kajiwara |
January 15, 2013 |
Wafer holding member
Claims
CLAIM The ornamental design for wafer holding member, as shown and
described.
Inventors: |
Kajiwara; Hideki (Koshi,
JP) |
Applicant: |
Name |
City |
State |
Country |
Type |
Kajiwara; Hideki |
Koshi |
N/A |
JP |
|
|
Assignee: |
Tokyo Electron Limited
(Minato-Ku, JP)
|
Appl.
No.: |
D/396,050 |
Filed: |
June 24, 2011 |
Foreign Application Priority Data
|
|
|
|
|
Jan 20, 2011 [JP] |
|
|
2011-001006 |
|
Current U.S.
Class: |
D13/182 |
Current International
Class: |
1303 |
Field of
Search: |
;D13/182
;118/500,725,728,729 ;294/103.1 ;414/217,222.01,416.03,941 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Burr & Brown
Description
FIG. 1 is front perspective view of a wafer holding member
illustrating my new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a bottom view thereof;
FIG. 4 is a front view thereof, the rear view being a mirror
image;
FIG. 5 is a left side view thereof;
FIG. 6 is a right side view thereof;
FIG. 7 is a sectional view taken along line 7-7 of FIG. 2; and,
FIG. 8 is an enlarged view of portion 8 encircled in FIG. 7.
* * * * *