Cover of an electronic device having surface ornamentation

Li December 4, 2

Patent Grant D671928

U.S. patent number D671,928 [Application Number D/425,180] was granted by the patent office on 2012-12-04 for cover of an electronic device having surface ornamentation. This patent grant is currently assigned to FIH (Hong Kong) Limited. Invention is credited to Bin Li.


United States Patent D671,928
Li December 4, 2012

Cover of an electronic device having surface ornamentation

Claims

CLAIM The ornamental design for a cover of an electronic device having surface ornamentation, as shown and described.
Inventors: Li; Bin (Shenzhen, CN)
Assignee: FIH (Hong Kong) Limited (Kowloon, HK)
Appl. No.: D/425,180
Filed: June 20, 2012

Current U.S. Class: D14/248
Current International Class: 1403
Field of Search: ;D14/248,138R,138AA,138AB,138AC,138AD,138C,138G,203.7,341-347,250,440,140,240,251-253,439,299,238.1,217,218,168-169,172,496,247,203 ;D3/201,218,269,273,301,303,248 ;D21/458,376 ;455/575.1,575.3,575.4,575.8,556.1,556.2 ;D25/103,110,111,117,118,145,154,155,156,157,158 ;D5/2,3,4,7,19,23,24,32,36,39,46,48,55,56,66,99,37-38,41,58-63,1,47,26,20,57,53,12,17,11,49,5,8,27,64,65 ;D13/103,108,107 ;D6/595,596,601,602,603,610,611,612,616,617,621,622,615,585 ;D11/22,96,131,132,140,1,125,76 ;D32/40 ;D12/213 ;15/215 ;428/30,38 ;52/506.06,316

References Cited [Referenced By]

U.S. Patent Documents
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D163245 May 1951 Bolten
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D667001 September 2012 Li

Other References

Electroplating Hollow Pattern PC Case, Gold Hard Back Cover for iPhone 4S/4, <URL:http://www.amazon.com/gp/product/images/B0088LT7IE/ref=dp.s- ub.--image.sub.--0?ie=UTF8&n=2335752011&s=wireless>, retrieved from internet on Sep. 10, 2012. cited by examiner .
Crazy Numerals metal protective case for Apple iPhone 4, <URL:http://cnn.cn/shop/crazy-numerals-metal-protective-case-apple-iph- one-verizon-iphone-cdma-iphone-rose-gold-p-15131.html>, retrieved from internet on May 8, 2012. cited by examiner.

Primary Examiner: Wright; Carla Jobe
Attorney, Agent or Firm: Altis Law Group, Inc.

Description



The present application is related to copending U.S. patent application Ser. Nos. 29/425,174, 29/425,175, 29/425,441, 29/425,177, 29/425,179, 29/425,182, 29/425,183, and 29/425,186, each entitled "Cover of an Electronic Device Having Surface Ornamentation", by Bin Li. These applications have the same assignee as the present application and have been concurrently filed herewith. The above-identified applications are incorporated herein by reference.

FIG. 1 is a perspective view of a cover of an electronic device having surface ornamentation showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a side elevational view thereof; and,

FIG. 4 is an enlarged fragmentary view thereof showing circled portion 4 in FIG. 2.

In FIGS. 1-3, the evenly segmented broken lines indicate portions of the cover of an electronic device having surface ornamentation that form no part of the claimed design. In FIGS. 2 and 4, the unevenly segmented broken lines indicate the portion of the design that is shown on an enlarged scale in FIG. 4. The broken lines form no part of the claimed design.

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References


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