Molded fingerprint sensor structure with indicia regions

Bond , et al. January 17, 2

Patent Grant D652332

U.S. patent number D652,332 [Application Number D/357,084] was granted by the patent office on 2012-01-17 for molded fingerprint sensor structure with indicia regions. This patent grant is currently assigned to Authentec, Inc.. Invention is credited to Robert Henry Bond, Giovanni Gozzini, Alan Kramer.


United States Patent D652,332
Bond ,   et al. January 17, 2012

Molded fingerprint sensor structure with indicia regions

Claims

CLAIM We claim the ornamental design for a molded fingerprint sensor structure with indicia regions, as shown and described.
Inventors: Bond; Robert Henry (Plano, TX), Kramer; Alan (Berkeley, CA), Gozzini; Giovanni (Berkeley, CA)
Assignee: Authentec, Inc. (Melbourne, FL)
Appl. No.: D/357,084
Filed: March 5, 2010

Current U.S. Class: D10/104.1
Current International Class: 1005
Field of Search: ;D10/104.1,106.6 ;D14/140.5,384 ;235/382 ;382/124

References Cited [Referenced By]

U.S. Patent Documents
D328594 August 1992 Kobayashi
D346340 April 1994 Cayton et al.
D351144 October 1994 Fishbine et al.
D362252 September 1995 Ansell et al.
D367270 February 1996 Levering
5844287 December 1998 Hassan et al.
5864296 January 1999 Upton
5942761 August 1999 Tuli
6061464 August 2001 Belongie et al.
6272562 August 2001 Scott et al.
6687391 February 2004 Scott et al.
6980286 December 2005 Feng
D516069 February 2006 Kuroda et al.
7147153 December 2006 Rowe et al.

Other References

Rowe, Robert K., "A Multispectral Sensor for Fingerprint Spoof Detection", Sensors, vol. 22, No. 1, (Jan. 2005), pp. 2-4. cited by other .
http://www.validityinc.com/post.aspx?id=147, "Validity Launches the First Customizable LED Fingerprint Sensor", Jan. 8, 2009. cited by other .
www.boschman.nl/technology/technology.htm. cited by other.

Primary Examiner: Kirschbaum; George D
Attorney, Agent or Firm: Allen, Dyer, Doppelt, Milbrath & Gilchrist, P.A.

Description



FIG. 1 is a perspective view of a fingerprint sensor chip with integrally molded bezels including indicia regions;

FIG. 2 is a left side elevation view of a fingerprint sensor chip with integrally molded bezels including indicia regions;

FIG. 3 is a front elevation view of a fingerprint sensor chip with integrally molded bezels including indicia regions;

FIG. 4 is a back elevation view of a fingerprint sensor chip with integrally molded bezels including indicia regions;

FIG. 5 is a bottom view of a fingerprint sensor chip with integrally molded bezels including indicia regions;

FIG. 6 is a top view of a fingerprint sensor chip with integrally molded bezels including indicia regions; and,

FIG. 7 is a right side elevation view of a fingerprint sensor chip with integrally molded bezels including indicia regions.

The broken lines depict unclaimed environmental subject matter.

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References


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