Bond; Robert Henry

Patent Applications and Registrations

Patent applications and USPTO patent grants for Bond; Robert Henry.The latest application filed is for "integrally molded die and bezel structure for fingerprint sensors and the like".

Company Profile

0.11.3

Bond; Robert Henry - Plano TX
Bond; Robert Henry - Oakland CA US

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Integrally molded die and bezel structure for fingerprint sensors and the like Grant 8,772,884 - Bond , et al. July 8, 2	2014-07-08
Integrally Molded Die And Bezel Structure For Fingerprint Sensors And The Like App 20130320464 - BOND; ROBERT HENRY ; et al.	2013-12-05
Pseudo-translucent integrated circuit package Grant 8,582,837 - Bond , et al. November 12, 2	2013-11-12
Integrally molded die and bezel structure for fingerprint sensors and the like Grant 8,569,875 - Bond , et al. October 29, 2	2013-10-29
Biometric sensor assembly with integrated visual indicator Grant 8,471,345 - Bond , et al. June 25, 2	2013-06-25
Integrally Molded Die And Bezel Structure For Fingerprint Sensors And The Like App 20130154031 - BOND; ROBERT HENRY ; et al.	2013-06-20
Integrally molded die and bezel structure for fingerprint sensors and the like Grant 8,378,508 - Bond , et al. February 19, 2	2013-02-19
Molded fingerprint sensor structure Grant D652,333 - Bond , et al. January 17, 2	2012-01-17
Molded fingerprint sensor structure with indicia regions Grant D652,332 - Bond , et al. January 17, 2	2012-01-17
System and method for controlling integrated circuit die height and planarity Grant 7,456,050 - Siegel , et al. November 25, 2	2008-11-25
System and method for controlling integrated circuit die height and planarity App 20050001330 - Siegel, Harry Michael ; et al.	2005-01-06

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