Lamp package

Andrews , et al. June 28, 2

Patent Grant D640645

U.S. patent number D640,645 [Application Number D/328,924] was granted by the patent office on 2011-06-28 for lamp package. This patent grant is currently assigned to Cree, Inc.. Invention is credited to Peter Andrews, Nicholas W. Medendorp, Jr..


United States Patent D640,645
Andrews ,   et al. June 28, 2011

Lamp package

Claims

CLAIM The ornamental design for a lamp package, as shown and described.
Inventors: Andrews; Peter (Durham, NC), Medendorp, Jr.; Nicholas W. (Raleigh, NC)
Assignee: Cree, Inc. (Durham, NC)
Appl. No.: D/328,924
Filed: December 4, 2008

Related U.S. Patent Documents

Application Number Filing Date Patent Number Issue Date
29248311 Aug 9, 2006 D591697

Current U.S. Class: D13/182; D26/2
Current International Class: 1399
Field of Search: ;D26/1,24,26,37,51-52,60,72 ;D10/109,111,113-114 ;362/555,125,154,157-159,182,184-186,194,641-642,646,652,655-656,800 ;D13/180-182 ;D16/200,203

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Other References

Search Report for Patent Application No. 096300826. cited by other .
Preliminary Notice of Reasons for Refusal for Design Application No. 2007-002963. cited by other .
Translation of Preliminary Notice of Reasons for Refusal for Design Application No. 2007-002963. cited by other .
Preliminary Notice of Reasons for Refusal for Design Application No. 2007-015113. cited by other .
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Cree introduces its first packaged LED product, LEDs Magazine, Oct. 2004, pp. 1-2. cited by other.

Primary Examiner: Simmons; Ian
Assistant Examiner: Sipos; Dana L
Attorney, Agent or Firm: Myers Bigel Sibley & Sajovec

Description



FIG. 1 is a top perspective view of a lamp package showing our new design, shown applied to an unclaimed printed circuit board;

FIG. 2 is a bottom plan view of the lamp package of the present invention;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is a side elevation view thereof; and,

FIG. 6 is a side elevation view thereof rotated 90 degrees.

The broken lines in the drawings showing the printed circuit board in FIG. 1 and the rectangular substrate in FIGS. 1-6 are for illustrative purposes only and form no part of the claimed design.

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