Headphone
Morisawa March 22, 2
U.S. patent number D634,731 [Application Number D/347,561] was granted by the patent office on 2011-03-22 for headphone. This patent grant is currently assigned to Sony Corporation. Invention is credited to Rui Morisawa.
| United States Patent | D634,731 |
| Morisawa | March 22, 2011 |
Headphone
Claims
CLAIM The ornamental design for a headphone, as shown and described.
| Inventors: | Morisawa; Rui (Tokyo, JP) |
|---|---|
| Assignee: | Sony Corporation (Tokyo,
JP) |
| Appl. No.: | D/347,561 |
| Filed: | March 4, 2010 |
Foreign Application Priority Data
| Oct 28, 2009 [JP] | D2009-25258 | |||
| Current U.S. Class: | D14/205 |
| Current International Class: | 1401 |
| Field of Search: | ;D14/205,206,223 ;181/129,130,135 ;379/430,431,449,433.11 ;381/380,381,378 ;D29/112,120,122 ;2/209,410-414,425,181.4,181.8,183,182.1,411,412,413,462,455,46 ;128/857,864,866,867 |
References Cited [Referenced By]
U.S. Patent Documents
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| D591263 | April 2009 | Shimizu |
| D592639 | May 2009 | Kuh et al. |
| D1077954 | Jul 2000 | JP | |||
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| D1335551 | Jul 2008 | JP | |||
Attorney, Agent or Firm: Rader, Fishman & Grauer PLLC
Description
FIG. 1 is a front, top, right perspective view of a headphone showing my new design;
FIG. 2 is a front, bottom perspective view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a rear elevational view thereof; and,
FIG. 5 is a bottom plan view thereof.
Portions in broken lines are for illustrative purposes only and form no part of claimed design.
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