Light emitting diode packaging carrier

Description

FIG. 1 is a front perspective view of the packaging carrier showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof; and,

FIG. 6 is a top plan view thereof.

FIG. 7 is a bottom plan view thereof wherein the broken lines form no part of the claimed design.

Claims

CLAIM The ornamental design for a light emitting diode packaging carrier, as shown and described.

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Inventors:	Chen; Chin-Ming (Hsinchu County, TW), Hsu; Chin-Chang (Pingtung County, TW), Liu; Hsuan-Chi (Hsinchu County, TW)
Assignee:	Lextar Electronics Corp. (Hsinchu, TW)
Appl. No.:	D/361,186
Filed:	May 6, 2010

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Foreign Application Priority Data

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Feb 12, 2010 [TW]			99300769

Current U.S. Class:	D13/180
Current International Class:	1303
Field of Search:	;D13/180 ;D26/2 ;257/79,80,81,88,89,95,98,99,100,E33.058 ;313/483,498,500 ;362/555,800

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References Cited [Referenced By]

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U.S. Patent Documents

D495304	August 2004	Kim et al.
D578969	October 2008	Kobayakawa
D584246	January 2009	Low et al.
D595244	June 2009	In et al.
D595245	June 2009	Kim et al.
D595675	July 2009	Wang et al.
D596591	July 2009	In et al.
D597971	August 2009	Kobayakawa et al.
D599750	September 2009	Kim et al.
D608309	January 2010	Kim

Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Schmeiser, Olsen & Watts LLP