Light emitting diode package
Ni , et al. October 5, 2
U.S. patent number D624,886 [Application Number D/358,359] was granted by the patent office on 2010-10-05 for light emitting diode package. This patent grant is currently assigned to Everlight Electronics Co., Ltd.. Invention is credited to Chun-Yao Ni, Chih-Chia Tsai.
| United States Patent | D624,886 |
| Ni , et al. | October 5, 2010 |
Light emitting diode package
Claims
CLAIM The ornamental design for a light emitting diode package, as shown and described.
| Inventors: | Ni; Chun-Yao (Taipei Hsien, TW), Tsai; Chih-Chia (Taipei Hsien, TW) |
|---|---|
| Assignee: | Everlight Electronics Co., Ltd.
(Tucheng, Taipei Hsien, TW) |
| Appl. No.: | D/358,359 |
| Filed: | March 26, 2010 |
Foreign Application Priority Data
| Jan 11, 2010 [TW] | 099300117 | |||
| Current U.S. Class: | D13/180 |
| Current International Class: | 1303 |
| Field of Search: | ;D13/180 ;D26/2 ;257/79,80,81,88,89,95,98,99,100,E33.058 ;313/483,498,500 ;362/555,800 |
References Cited [Referenced By]
U.S. Patent Documents
| 6777719 | August 2004 | Fujii |
| 7049639 | May 2006 | Wang et al. |
| D576571 | September 2008 | Itai |
| D590356 | April 2009 | Takano et al. |
| D590358 | April 2009 | Miyashita et al. |
| D599303 | September 2009 | Seo et al. |
| 2006/0113906 | June 2006 | Ogawa |
| 2006/0214273 | September 2006 | Wang et al. |
| D1066550-004 | Jul 2000 | JP | |||
Attorney, Agent or Firm: Hsu; Winston Margo; Scott Teng; Min-Lee
Description
FIG. 1 is a perspective view of a light emitting diode package with the new design, with a slot structured circuit board incorporated;
FIG. 2 is a front view thereof;
FIG. 3 is a left side view thereof;
FIG. 4 is a right side view thereof;
FIG. 5 is a top plan view thereof, wherein a slot structured circuit board is disposed on the bottom of the light emitting diode package; and,
FIG. 6 is a bottom plan view thereof.
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