U.S. patent number D624,886 [Application Number D/358,359] was granted by the patent office on 2010-10-05 for light emitting diode package.
This patent grant is currently assigned to Everlight Electronics Co., Ltd.. Invention is credited to Chun-Yao Ni, Chih-Chia Tsai.
United States Patent |
D624,886 |
Ni , et al. |
October 5, 2010 |
Light emitting diode package
Claims
CLAIM The ornamental design for a light emitting diode package, as
shown and described.
Inventors: |
Ni; Chun-Yao (Taipei Hsien,
TW), Tsai; Chih-Chia (Taipei Hsien, TW) |
Assignee: |
Everlight Electronics Co., Ltd.
(Tucheng, Taipei Hsien, TW)
|
Appl.
No.: |
D/358,359 |
Filed: |
March 26, 2010 |
Foreign Application Priority Data
|
|
|
|
|
Jan 11, 2010 [TW] |
|
|
099300117 |
|
Current U.S.
Class: |
D13/180 |
Current International
Class: |
1303 |
Field of
Search: |
;D13/180 ;D26/2
;257/79,80,81,88,89,95,98,99,100,E33.058 ;313/483,498,500
;362/555,800 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Hsu; Winston Margo; Scott Teng;
Min-Lee
Description
FIG. 1 is a perspective view of a light emitting diode package with
the new design, with a slot structured circuit board
incorporated;
FIG. 2 is a front view thereof;
FIG. 3 is a left side view thereof;
FIG. 4 is a right side view thereof;
FIG. 5 is a top plan view thereof, wherein a slot structured
circuit board is disposed on the bottom of the light emitting diode
package; and,
FIG. 6 is a bottom plan view thereof.
* * * * *