Light emitting diode module
Yamada August 31, 2
U.S. patent number D622,683 [Application Number D/359,245] was granted by the patent office on 2010-08-31 for light emitting diode module. This patent grant is currently assigned to Nichia Corporation. Invention is credited to Motokazu Yamada.
| United States Patent | D622,683 |
| Yamada | August 31, 2010 |
Light emitting diode module
Claims
CLAIM The ornamental design for a light emitting diode module, as shown and described.
| Inventors: | Yamada; Motokazu (Tokushima, JP) |
|---|---|
| Assignee: | Nichia Corporation (Anan-shi,
JP) |
| Appl. No.: | D/359,245 |
| Filed: | April 7, 2010 |
Related U.S. Patent Documents
| Application Number | Filing Date | Patent Number | Issue Date | ||
|---|---|---|---|---|---|
| 29344931 | Oct 6, 2009 | ||||
Foreign Application Priority Data
| Apr 8, 2009 [JP] | 2009-8098 | |||
| Apr 8, 2009 [JP] | 2009-8099 | |||
| Apr 8, 2009 [JP] | 2009-8100 | |||
| Apr 8, 2009 [JP] | 2009-8102 | |||
| Current U.S. Class: | D13/180 |
| Current International Class: | 1303 |
| Field of Search: | ;D13/180 ;D26/2 ;257/79,80,81,88,89,95,98,99,100,E33.058 ;313/483,498,500 ;362/555,800 |
References Cited [Referenced By]
U.S. Patent Documents
| 6885034 | April 2005 | Schoenfeld |
| D505661 | May 2005 | Suenaga |
| D517026 | March 2006 | Suenaga |
| D524260 | July 2006 | Ishizaka et al. |
| D575245 | August 2008 | Yen |
| D586303 | February 2009 | Fuwa et al. |
| D591248 | April 2009 | Imai et al. |
| D592615 | May 2009 | Imai et al. |
| 7635875 | December 2009 | Niki et al. |
| D607420 | January 2010 | Imai et al. |
| D615052 | May 2010 | Imai et al. |
| D618635 | June 2010 | Imai et al. |
| D1296262 | Mar 2007 | JP | |||
| D1307574 | Aug 2007 | JP | |||
| D1339027 | Sep 2008 | JP | |||
| D1352471 | Mar 2009 | JP | |||
| D1352645 | Mar 2009 | JP | |||
| D1368730 | Sep 2009 | JP | |||
| D1369119 | Sep 2009 | JP | |||
Attorney, Agent or Firm: Global IP Counselors, LLP
Description
FIG. 1 is a front elevational view of a light emitting diode module in accordance with an embodiment of my new design;
FIG. 2 is a top plan view of the light emitting diode module in accordance with the embodiment of my new design;
FIG. 3 is a bottom plan view of the light emitting diode module in accordance with the embodiment of my new design;
FIG. 4 is a left side elevational view of the light emitting diode module in accordance with the embodiment of my new design; and,
FIG. 5 is a right side elevational view of the light emitting diode module in accordance with the embodiment of my new design.
The broken line showing of environment (the remaining structure of the light emitting diode module) in the FIGS. 1-5 is for illustrative purposes only and forms no part of the claimed design.
The diagonal line shading illustrates a transparent portion of the light emitting diode module.
The bottom plan view of the light emitting diode module is omitted because the bottom surface of the light emitting diode module is flat and devoid of surface ornamentation.
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