Heat dissipation apparatus Patent Grant Hu , et al. August 17, 2 [Foxsemicon Integrated Technology, Inc.]

Heat dissipation apparatus

Hu , et al. August 17, 2

Patent Grant D621796

U.S. patent number D621,796 [Application Number D/346,660] was granted by the patent office on 2010-08-17 for heat dissipation apparatus. This patent grant is currently assigned to Foxsemicon Integrated Technology, Inc.. Invention is credited to Chi-Chung Hu, Zheng-Jay Huang, Rong-Yih Yan.

United States Patent	D621,796
Hu , et al.	August 17, 2010

Heat dissipation apparatus

Claims

CLAIM The ornamental design for a heat dissipation apparatus, as shown.

Inventors:	Hu; Chi-Chung (Miao-Li Hsien, TW), Huang; Zheng-Jay (Miao-Li Hsien, TW), Yan; Rong-Yih (Miao-Li Hsien, TW)
Assignee:	Foxsemicon Integrated Technology, Inc. (Chu-Nan, Miao-Li Hsien, TW)
Appl. No.:	D/346,660
Filed:	November 4, 2009

Foreign Application Priority Data


Aug 14, 2009 [CN]			2009 3 0311756

Current U.S. Class:	D13/179
Current International Class:	1303
Field of Search:	;D13/179 ;165/80.3,104.33,151,122,185 ;257/706,707,718-722 ;361/687,695,697,700,702,703,704,709,710,711,719

References Cited [Referenced By]

U.S. Patent Documents


4899210	February 1990	Lorenzetti et al.
6025643	February 2000	Auger
D471168	March 2003	Ge et al.
6736204	May 2004	Gollan et al.
6975511	December 2005	Lebo et al.
7371965	May 2008	Ice
7529094	May 2009	Miller
7539018	May 2009	Murr et al.
7593230	September 2009	Abul-Haj et al.
2008/0066888	March 2008	Tong et al.

Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Chew; Raymond J.

Description

FIG. 1 is a perspective view of a heat dissipation apparatus in one operational state.

FIG. 2 is a front elevational view thereof.

FIG. 3 is a rear elevational view thereof.

FIG. 4 is a left-side, elevational view thereof.

FIG. 5 is a right-side, elevational view thereof.

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

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