Heat dissipation device Patent Grant Lin June 29, 2 [Foxsemicon Integrated Technology, Inc.]

Heat dissipation device

Lin June 29, 2

Patent Grant D618633

U.S. patent number D618,633 [Application Number D/346,025] was granted by the patent office on 2010-06-29 for heat dissipation device. This patent grant is currently assigned to Foxsemicon Integrated Technology, Inc.. Invention is credited to Shan-Ju Lin.

United States Patent	D618,633
Lin	June 29, 2010

Heat dissipation device

Claims

CLAIM The ornamental design for a heat dissipation device, as shown.

Inventors:	Lin; Shan-Ju (Miao-Li Hsien, TW)
Assignee:	Foxsemicon Integrated Technology, Inc. (Chu-Nan, Miao-Li Hsien, TW)
Appl. No.:	D/346,025
Filed:	October 26, 2009

Foreign Application Priority Data


Jul 21, 2009 [CN]			2009 3 0309786

Current U.S. Class:	D13/179
Current International Class:	1303
Field of Search:	;D13/179 ;165/80.3,104.33,151,122,185 ;257/706,707,718-722 ;361/687,695,697,700,702,704,709,710,711,719,294,373 ;313/35,44,46,113 ;D26/2

References Cited [Referenced By]

U.S. Patent Documents


7396146	July 2008	Wang
D579421	October 2008	Chu
D579422	October 2008	Shuai et al.
2007/0236935	October 2007	Wang
2008/0158887	July 2008	Zhu et al.
2008/0175003	July 2008	Tsou et al.
2009/0147520	June 2009	Liu et al.
2009/0244899	October 2009	Chyn
2009/0279314	November 2009	Wu et al.
2009/0308575	December 2009	Yao
2010/0026158	February 2010	Wu
2010/0027258	February 2010	Maxik et al.

Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Chew; Raymond J.

Description

FIG. 1 is a perspective view of a heat dissipation device showing my new design.

FIG. 2 is a front elevational view thereof.

FIG. 3 is a rear elevational view thereof.

FIG. 4 is a left-side, elevational view thereof.

FIG. 5 is a right-side, elevational view thereof.

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

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